(footprint "Molex_MicroClasp_55932-0930_1x09_P2.00mm_Vertical" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5B7810CB)
  (descr "Molex MicroClasp Wire-to-Board System, 55932-0930, 9 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator")
  (tags "connector Molex MicroClasp side entry")
  (attr through_hole)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp c107945c-e708-42c4-afe0-2aca62066f53)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b8423fa2-b3c0-4fef-b9f1-f0b128f23de3)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 09915cc8-f2b7-4374-a76d-a5dc94f75913)
  )
  (fp_line (start 19.11 3.11) (end 8 3.11) (layer "F.SilkS") (width 0.12) (tstamp 26fef044-3cfe-493d-8abe-94b72eb6d10c))
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  (pad "4" thru_hole oval (at 6 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 47700352-7714-4328-bb92-9f56f478decc))
  (pad "5" thru_hole oval (at 8 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 60af0da6-cf2d-4fb3-a4d4-038d8949cba8))
  (pad "6" thru_hole oval (at 10 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp ae570287-db42-487b-b809-93d28aee48b1))
  (pad "7" thru_hole oval (at 12 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp bebb86f5-5135-4d34-b7bc-80401ef79f18))
  (pad "8" thru_hole oval (at 14 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 7b3b749d-8892-4823-9ab0-912d73bec9f5))
  (pad "9" thru_hole oval (at 16 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 6613c4b6-9a17-441a-b006-d85b4d80b9d2))
  (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_MicroClasp_55932-0930_1x09_P2.00mm_Vertical.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)