(footprint "Molex_MicroClasp_55932-1030_1x10_P2.00mm_Vertical" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5B7810CB)
  (descr "Molex MicroClasp Wire-to-Board System, 55932-1030, 10 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator")
  (tags "connector Molex MicroClasp side entry")
  (attr through_hole)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 09b59bce-a0b2-4ff4-947d-788ff710a452)
  )
  (fp_text value "Molex_MicroClasp_55932-1030_1x10_P2.00mm_Vertical" (at 9 4.2) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 5593acbd-6b9d-4cf1-99fa-0be5336de213)
  )
  (fp_text user "${REFERENCE}" (at 9 -2.1) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b2c418ae-30b6-4aff-a35f-9b8d0e7b1d29)
  )
  (fp_line (start -3.41 3.41) (end -1 3.41) (layer "F.SilkS") (width 0.12) (tstamp 25737d64-1366-429a-bc1c-805d4ae59bec))
  (fp_line (start 9 -3.81) (end 12.5 -3.81) (layer "F.SilkS") (width 0.12) (tstamp 26176b3a-b39a-4a8d-86fe-533de71e989d))
  (fp_line (start -3.41 1) (end -3.41 3.41) (layer "F.SilkS") (width 0.12) (tstamp 5d214ea7-4a01-41b9-a515-adb1debcbc38))
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  (fp_line (start 21.5 -4.2) (end -3.5 -4.2) (layer "F.CrtYd") (width 0.05) (tstamp a9ebaa34-eedd-4d7d-9eed-d679908bdca5))
  (fp_line (start 21.5 3.5) (end 21.5 -4.2) (layer "F.CrtYd") (width 0.05) (tstamp dd32c3d9-a3f4-46d4-ab0b-3911fec1d561))
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  (fp_line (start -3 -2.8) (end -3 3) (layer "F.Fab") (width 0.1) (tstamp 329aa6c4-06c5-470b-a666-7ea33d72fb08))
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  (fp_line (start -3 3) (end 9 3) (layer "F.Fab") (width 0.1) (tstamp 786341ef-ef49-4c7d-97b9-4c39bad97124))
  (fp_line (start 21 3) (end 9 3) (layer "F.Fab") (width 0.1) (tstamp 9002d5cf-fe6a-40f7-a767-4e91b37f9758))
  (fp_line (start 9 -3.7) (end 5.61 -3.7) (layer "F.Fab") (width 0.1) (tstamp 917d7711-538c-4dc6-9f4d-32dfe1c589eb))
  (fp_line (start 21 -2.8) (end 21 3) (layer "F.Fab") (width 0.1) (tstamp a2a02929-2113-428e-b243-ecff9b5e5deb))
  (fp_line (start 12.39 -2.8) (end 21 -2.8) (layer "F.Fab") (width 0.1) (tstamp aed151a6-0ade-4fa1-8272-126a5de16510))
  (fp_line (start 5.61 -3.7) (end 5.61 -2.8) (layer "F.Fab") (width 0.1) (tstamp e738ebda-c1d3-46fd-b24e-bc49bc22b266))
  (pad "1" thru_hole roundrect (at 0 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0.208333) (tstamp 0f3ec9e5-4f70-47c3-961e-97abd81f2f58))
  (pad "2" thru_hole oval (at 2 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp f171a7e9-d37e-4122-866e-93e5f5d02db4))
  (pad "3" thru_hole oval (at 4 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 756e9fa6-722f-4f9f-b874-7dd60e33aa14))
  (pad "4" thru_hole oval (at 6 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 6ac89e00-2dbd-4814-954b-6d0c6c5973a5))
  (pad "5" thru_hole oval (at 8 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp f809f94e-bd0d-4d8a-831b-2625efb08c28))
  (pad "6" thru_hole oval (at 10 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp eaa86cd4-341e-4719-a1bb-9de657d2b1ae))
  (pad "7" thru_hole oval (at 12 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp a5a59c4e-09e8-49d5-88f0-6837ba434038))
  (pad "8" thru_hole oval (at 14 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 28750f9f-6e75-413f-871c-6bb283c0336b))
  (pad "9" thru_hole oval (at 16 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp b9d7ef96-d7eb-45ea-9885-c4893ed0b997))
  (pad "10" thru_hole oval (at 18 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 250745d8-27c2-4f35-b9f0-07ae91bbed06))
  (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_MicroClasp_55932-1030_1x10_P2.00mm_Vertical.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)