(footprint "Molex_MicroClasp_55932-1130_1x11_P2.00mm_Vertical" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5B7810CB)
  (descr "Molex MicroClasp Wire-to-Board System, 55932-1130, 11 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator")
  (tags "connector Molex MicroClasp side entry")
  (attr through_hole)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp eb5be798-0a3c-4beb-a261-570204cb7f1e)
  )
  (fp_text value "Molex_MicroClasp_55932-1130_1x11_P2.00mm_Vertical" (at 10 4.2) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 61c80c6c-a13b-43b2-9772-5b1692d87cfd)
  )
  (fp_text user "${REFERENCE}" (at 10 -2.1) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 638c9ecc-6da0-45d0-bb76-4f3bb5ee57c8)
  )
  (fp_line (start 23.11 3.11) (end 10 3.11) (layer "F.SilkS") (width 0.12) (tstamp 1b292704-4d05-46d6-b0a9-aa2e4cff6b3f))
  (fp_line (start 13.5 -3.81) (end 13.5 -2.91) (layer "F.SilkS") (width 0.12) (tstamp 1dbaebf8-2a45-4196-ba35-f2dbc341b7df))
  (fp_line (start -3.41 1) (end -3.41 3.41) (layer "F.SilkS") (width 0.12) (tstamp 2890718c-329b-4933-827f-c33ba7db0a98))
  (fp_line (start 10 -3.81) (end 6.5 -3.81) (layer "F.SilkS") (width 0.12) (tstamp 475eb87b-c943-43ff-a080-055bdb8364cc))
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  (fp_line (start -3.11 3.11) (end 10 3.11) (layer "F.SilkS") (width 0.12) (tstamp 6b74cee5-8e7e-4f67-9792-1f91cd30b620))
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  (fp_line (start 23.5 3.5) (end 23.5 -4.2) (layer "F.CrtYd") (width 0.05) (tstamp 8f4e0894-aa2b-4474-a96a-d0efa881058d))
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  (fp_line (start -3 3) (end 10 3) (layer "F.Fab") (width 0.1) (tstamp 39fad2de-1825-436c-8e96-9720fffe9f04))
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  (fp_line (start -3 -2.8) (end -3 3) (layer "F.Fab") (width 0.1) (tstamp b459f9d7-10ec-4cd2-af50-cdd39937576e))
  (fp_line (start 23 -2.8) (end 23 3) (layer "F.Fab") (width 0.1) (tstamp ca7a8983-e312-4742-8d23-0434e70e166d))
  (fp_line (start 10 -3.7) (end 6.61 -3.7) (layer "F.Fab") (width 0.1) (tstamp cf6cfe96-6ad8-4e40-b473-215e4ad8ec24))
  (fp_line (start 23 3) (end 10 3) (layer "F.Fab") (width 0.1) (tstamp f69e1052-22bb-4211-8f02-1f34e54e61e2))
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  (pad "1" thru_hole roundrect (at 0 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0.208333) (tstamp d319538b-9db9-44ad-9bc5-148bf0d3268b))
  (pad "2" thru_hole oval (at 2 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 574cd31d-eff0-4184-be76-1ae01090741c))
  (pad "3" thru_hole oval (at 4 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 80481bcd-578f-412d-974a-60a4eca0d0a5))
  (pad "4" thru_hole oval (at 6 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 042104a5-7159-4e56-852d-e4ab50479e60))
  (pad "5" thru_hole oval (at 8 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 5dc824da-4ca3-42a7-aa7a-514bbd7031dc))
  (pad "6" thru_hole oval (at 10 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp d924d95c-a27d-4a7c-8f5e-20b318f7bd01))
  (pad "7" thru_hole oval (at 12 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 36ed77d2-f06b-4e89-9ee9-d42f5c04b926))
  (pad "8" thru_hole oval (at 14 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp c7f12390-d082-4c57-a0bf-a2dadc5d633c))
  (pad "9" thru_hole oval (at 16 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 449ecac1-8a92-429c-a8ac-65e017b0f0a4))
  (pad "10" thru_hole oval (at 18 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp ad6b3f03-df75-4134-9873-c2b28d069ecb))
  (pad "11" thru_hole oval (at 20 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 4676d7c7-ce15-4f56-bd89-e639ed905984))
  (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_MicroClasp_55932-1130_1x11_P2.00mm_Vertical.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)