(footprint "Molex_MicroClasp_55932-1310_1x13_P2.00mm_Vertical" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5B7810CC)
  (descr "Molex MicroClasp Wire-to-Board System, 55932-1310, with PCB locator, 13 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator")
  (tags "connector Molex MicroClasp side entry")
  (attr through_hole)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 43426495-2e47-4d60-ab3d-773f7cd40888)
  )
  (fp_text value "Molex_MicroClasp_55932-1310_1x13_P2.00mm_Vertical" (at 12 4.2) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b024d7bc-639e-4ab0-bb29-38252396966f)
  )
  (fp_text user "${REFERENCE}" (at 12 -2.1) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 0444cd6b-7ea8-40ac-a467-bb87569cfcb0)
  )
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  (fp_line (start 27.5 -4.2) (end -3.5 -4.2) (layer "F.CrtYd") (width 0.05) (tstamp a859d028-5ad4-4085-9044-b23d913301c5))
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  (fp_line (start -3.5 -4.2) (end -3.5 3.5) (layer "F.CrtYd") (width 0.05) (tstamp ee465c10-f4e6-4f1d-877c-d50edaa971fe))
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  (fp_line (start -3 -2.8) (end -3 3) (layer "F.Fab") (width 0.1) (tstamp a0f49b70-7f54-4f1d-b789-95b3b9d4bc6a))
  (fp_line (start 27 3) (end 12 3) (layer "F.Fab") (width 0.1) (tstamp b0c7024e-9ea1-4664-8f39-f28f0dbc0842))
  (fp_line (start -3 3) (end 12 3) (layer "F.Fab") (width 0.1) (tstamp e5ace8b0-115b-4a96-a317-f0e56daeca7c))
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  (pad "" np_thru_hole circle (at 26 -1.9) (size 1.3 1.3) (drill 1.3) (layers *.Cu *.Mask) (tstamp 4eadd4b9-1ce7-400d-92fd-075be48a48b1))
  (pad "1" thru_hole roundrect (at 0 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0.208333) (tstamp 702a9340-5d8a-4a53-9713-5bbcc3bd2c9d))
  (pad "2" thru_hole oval (at 2 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 9a51e359-c266-495a-ad78-58a2b53c5f93))
  (pad "3" thru_hole oval (at 4 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 7cddd346-433c-4dda-97a2-6ddd1b4e3b44))
  (pad "4" thru_hole oval (at 6 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 45fcf9f4-0364-411d-b3cf-a30819325187))
  (pad "5" thru_hole oval (at 8 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 73f8596b-91fd-4f52-b03f-2921d22490f4))
  (pad "6" thru_hole oval (at 10 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 49cf7d84-a9b0-4427-bec3-1700fdcbcec9))
  (pad "7" thru_hole oval (at 12 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 4181045a-e942-415e-851e-2dd6d9f7d2d8))
  (pad "8" thru_hole oval (at 14 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp cb143c3a-9dfd-41ba-9882-a831ebff9ff1))
  (pad "9" thru_hole oval (at 16 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp d6e0b337-c899-4e67-b27b-8d54b2c6dc88))
  (pad "10" thru_hole oval (at 18 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 49f38d75-9863-4796-9e56-d78df508458f))
  (pad "11" thru_hole oval (at 20 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 720b0552-a348-4c49-af26-3a52167ee06f))
  (pad "12" thru_hole oval (at 22 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 582d36ca-b34d-4058-9806-863764eaadcc))
  (pad "13" thru_hole oval (at 24 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 4b1c7e84-d6ef-4166-bae5-f78ce1b90edc))
  (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_MicroClasp_55932-1310_1x13_P2.00mm_Vertical.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)