(footprint "Molex_MicroClasp_55932-1330_1x13_P2.00mm_Vertical" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5B7810CC)
  (descr "Molex MicroClasp Wire-to-Board System, 55932-1330, 13 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator")
  (tags "connector Molex MicroClasp side entry")
  (attr through_hole)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp bbfeb84a-0e0e-46df-8554-3b4d2286a42d)
  )
  (fp_text value "Molex_MicroClasp_55932-1330_1x13_P2.00mm_Vertical" (at 12 4.2) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 1f33201f-1d89-4cb2-9a1c-ec7779a982cb)
  )
  (fp_text user "${REFERENCE}" (at 12 -2.1) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 86476b34-9fbf-4d14-961e-80f1f7535872)
  )
  (fp_line (start -3.41 1) (end -3.41 3.41) (layer "F.SilkS") (width 0.12) (tstamp 23470a0d-3ba6-4d42-a227-8181bf9c7582))
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  (fp_line (start 8.5 -2.91) (end -3.11 -2.91) (layer "F.SilkS") (width 0.12) (tstamp 3f215967-421f-400c-828d-6369f410c802))
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  (fp_line (start -3.5 -4.2) (end -3.5 3.5) (layer "F.CrtYd") (width 0.05) (tstamp accb89ba-5046-4c6a-8531-5fbf46b05ce6))
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  (fp_line (start 27 -2.8) (end 27 3) (layer "F.Fab") (width 0.1) (tstamp 9ea8d38c-c3b9-4fb6-9288-1cb14b731b10))
  (fp_line (start 0 2.292893) (end 0.5 3) (layer "F.Fab") (width 0.1) (tstamp b7c298ea-a254-4aca-bb4b-446f22d91343))
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  (pad "1" thru_hole roundrect (at 0 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0.208333) (tstamp 876f4cf9-856d-475e-8fa1-afc721cac471))
  (pad "2" thru_hole oval (at 2 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 29eb66fc-6102-42a5-be2d-ac87826c73a9))
  (pad "3" thru_hole oval (at 4 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp d10c2989-2bc6-4b3d-9d39-ecbae37b1f32))
  (pad "4" thru_hole oval (at 6 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp ddce62ce-227f-4769-9267-08762af2209e))
  (pad "5" thru_hole oval (at 8 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp bfd3c95b-794c-42ed-97d2-f97ca0bd3548))
  (pad "6" thru_hole oval (at 10 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 5fc1a6ee-19c0-486f-be90-c6d25dc8ff26))
  (pad "7" thru_hole oval (at 12 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 58be0555-f1ec-4c0d-a4a6-9ce375b9aec5))
  (pad "8" thru_hole oval (at 14 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 2afdea8d-1974-4e94-83c6-bffcff3e2b1d))
  (pad "9" thru_hole oval (at 16 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 6a839c54-f84e-4498-b9f5-8cfec216664b))
  (pad "10" thru_hole oval (at 18 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp ed5eea13-5172-4ea2-b077-026655664c45))
  (pad "11" thru_hole oval (at 20 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp a5e48d01-838a-4b59-b9e8-b9b5704cde19))
  (pad "12" thru_hole oval (at 22 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp f63bdab1-01f7-4526-bc75-675893f3d85d))
  (pad "13" thru_hole oval (at 24 0) (size 1.2 1.8) (drill 0.8) (layers *.Cu *.Mask) (tstamp 09c6803d-65d9-4e60-a23b-a656b7674d7b))
  (model "${KICAD6_3DMODEL_DIR}/Connector_Molex.3dshapes/Molex_MicroClasp_55932-1330_1x13_P2.00mm_Vertical.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)