(footprint "Converter_DCDC_RECOM_RPMx.x-x.0" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5C6321BD)
  (descr "https://www.recom-power.com/pdf/Innoline/RPM-6.0.pdf")
  (tags "dc-dc recom buck lga-25 pitch 2.29mm")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 28421a3b-5f12-41c6-b82d-3c314afee29e)
  )
  (fp_text value "Converter_DCDC_RECOM_RPMx.x-x.0" (at 0 8) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 5fedddd9-67d4-4ae5-9f94-534d35ba148d)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp e47d7771-fcd8-4850-bea0-af4b5279eac8)
  )
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  (fp_line (start -5.7 -6.5) (end -6.5 -6.5) (layer "F.SilkS") (width 0.12) (tstamp a00738da-91f2-427f-a3c4-f0481ae2453a))
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  (fp_line (start -7.1 -7.1) (end 7.1 -7.1) (layer "F.CrtYd") (width 0.05) (tstamp b6dc543c-f0c1-49f5-a42b-e56647896020))
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  (fp_line (start -6.095 -5.095) (end -5.095 -6.095) (layer "F.Fab") (width 0.1) (tstamp f2ecaa1a-15b0-43b5-817b-a056a33699bd))
  (pad "A1" smd rect (at -4.58 -4.58) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4c9366ef-c1a4-4ef1-ab1a-4f5f570c1bb0))
  (pad "A2" smd rect (at -2.29 -4.58) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 748adb3f-1683-45ad-9d85-035b40a6bedb))
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  (pad "B3" smd rect (at 0 -2.29) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp deba93a2-cb76-4c87-bc02-9a40b7389b5c))
  (pad "B4" smd rect (at 2.29 -2.29) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d945b472-8c9a-4829-b67e-2b8864dbcf97))
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  (pad "C5" smd rect (at 4.58 0) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a97a0488-7c45-4cca-8320-eaf128a31411))
  (pad "D1" smd rect (at -4.58 2.29) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp bb2bbd39-ae5f-4b5d-a235-f74c42c18ece))
  (pad "D2" smd rect (at -2.29 2.29) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 44e6411c-925b-40e6-8a66-9053075d70b0))
  (pad "D3" smd rect (at 0 2.29) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f3247822-705e-414e-9f80-75725af0c325))
  (pad "D4" smd rect (at 2.29 2.29) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fa5b92af-22dd-40a3-a7fe-e36f5477bb67))
  (pad "D5" smd rect (at 4.58 2.29) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fddba592-a166-40c1-86d9-73642fe5ce26))
  (pad "E1" smd rect (at -4.58 4.58) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 16f6473b-3c8a-4d95-abe6-7e212c10de13))
  (pad "E2" smd rect (at -2.29 4.58) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7fa83174-0570-4ca6-a9a2-53a30aff67fc))
  (pad "E3" smd rect (at 0 4.58) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a5ab6675-3ae7-40cc-9289-a8c99c5e2819))
  (pad "E4" smd rect (at 2.29 4.58) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e7d5a484-7059-4575-9b6c-437476fca136))
  (pad "E5" smd rect (at 4.58 4.58) (size 1.06 1.06) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2b22ecf0-7fbc-45da-8e11-d0f5d30fe550))
)