(footprint "Microchip_TFBGA-196_11x11mm_Layout14x14_P0.75mm_SMD" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5D96CE1E)
  (descr "TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956")
  (tags "BGA 196 0.75")
  (solder_mask_margin -0.0375)
  (solder_paste_margin 0.000001)
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 1749ae45-8415-4834-8b9f-5f6d08b8d0d2)
  )
  (fp_text value "Microchip_TFBGA-196_11x11mm_Layout14x14_P0.75mm_SMD" (at 0 6.5) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp bf08513c-8ea2-46b8-baf5-80c078de1bef)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp d79a6332-632a-462c-8210-1880e387812b)
  )
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  (pad "P10" smd circle (at 1.875 4.875) (size 0.35 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e0a486a3-cb12-49fb-9b4e-9caace35cb03))
  (pad "P11" smd circle (at 2.625 4.875) (size 0.35 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ddb2be86-e3be-46e5-a505-2ebf323520cd))
  (pad "P12" smd circle (at 3.375 4.875) (size 0.35 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 67a946aa-bcab-4526-90c5-5311aa92dad1))
  (pad "P13" smd circle (at 4.125 4.875) (size 0.35 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6f725fce-21dd-495c-8e66-0cca358b64f1))
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  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/Microchip_TFBGA-196_11x11mm_Layout14x14_P0.75mm_SMD.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)