(footprint "WLP-9_1.448x1.468mm_Layout3x3_P0.4mm_Ball0.27mm_Pad0.25mm" (version 20211014) (generator pcbnew) (layer "F.Cu") (tedit 5EF24926) (descr "WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF") (tags "BGA 9 0.4") (solder_mask_margin 0.02) (solder_paste_margin 0.000001) (attr smd) (fp_text reference "REF**" (at 0 -1.724) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))) (tstamp 2fbefc4e-f34c-4647-9729-02d3eff7e53d) ) (fp_text value "WLP-9_1.448x1.468mm_Layout3x3_P0.4mm_Ball0.27mm_Pad0.25mm" (at 0 1.724) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp 8a2761b7-e2d1-4be2-b3a0-07610355cdf7) ) (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") (effects (font (size 0.34 0.34) (thickness 0.051))) (tstamp 722460c8-77ae-4397-81ca-c83b218065bf) ) (fp_line (start -0.482 -0.834) (end 0.844 -0.834) (layer "F.SilkS") (width 0.12) (tstamp 373ba2a5-93fa-4212-bbe3-bfd52048a8c4)) (fp_line (start 0.844 -0.834) (end 0.844 0.834) (layer "F.SilkS") (width 0.12) (tstamp 4fb28e47-67b7-46ae-8d9b-3309b9167e43)) (fp_line (start 0.844 0.834) (end -0.844 0.834) (layer "F.SilkS") (width 0.12) (tstamp 946e02e9-ca0a-4577-a157-7b43dfe3b71c)) (fp_line (start -0.844 0.834) (end -0.844 -0.472) (layer "F.SilkS") (width 0.12) (tstamp c5f2f31a-6466-4998-b665-56f625555ee7)) (fp_line (start 1.74 -1.73) (end -1.74 -1.73) (layer "F.CrtYd") (width 0.05) (tstamp 03899e02-1124-4dd9-82f7-14bc5dcd2da6)) (fp_line (start -1.74 -1.73) (end -1.74 1.73) (layer "F.CrtYd") (width 0.05) (tstamp 5a4c875f-0198-4cc9-bae5-ed7f954a43e4)) (fp_line (start 1.74 1.73) (end 1.74 -1.73) (layer "F.CrtYd") (width 0.05) (tstamp 767a1102-cfd1-4fdb-bf60-71a410f251fc)) (fp_line (start -1.74 1.73) (end 1.74 1.73) (layer "F.CrtYd") (width 0.05) (tstamp ac2fa030-c242-451e-acee-fb76ccf0f2f8)) (fp_line (start 0.734 -0.724) (end 0.734 0.724) (layer "F.Fab") (width 0.1) (tstamp 11fae689-a379-4a62-ac1e-5215451206a4)) (fp_line (start 0.734 0.724) (end -0.734 0.724) (layer "F.Fab") (width 0.1) (tstamp 245a2e74-74d0-4665-ae9c-9e08ecaacf86)) (fp_line (start -0.372 -0.724) (end 0.734 -0.724) (layer "F.Fab") (width 0.1) (tstamp 3e7b6828-ca21-4cdb-977f-642eb58a02f3)) (fp_line (start -0.734 0.724) (end -0.734 -0.362) (layer "F.Fab") (width 0.1) (tstamp 3fd11a1d-5a54-4b7a-8b5c-be3403f6aa71)) (fp_line (start -0.734 -0.362) (end -0.372 -0.724) (layer "F.Fab") (width 0.1) (tstamp 7b5613b9-90d3-4824-a391-a9ca6afc9f8c)) (pad "A1" smd circle (at -0.4 -0.4) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp df4cbc20-05db-49bc-9901-18d44b747628)) (pad "A2" smd circle (at 0 -0.4) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 68ac8f76-c581-46d9-afde-b67bb49526f3)) (pad "A3" smd circle (at 0.4 -0.4) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d9aa5e17-6f85-42d9-951d-1b0aeb0c14e0)) (pad "B1" smd circle (at -0.4 0) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b2322a31-cc59-442d-86e6-34947aa9cf43)) (pad "B2" smd circle (at 0 0) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f87f671e-2ec1-4f5b-97df-1528841eec9e)) (pad "B3" smd circle (at 0.4 0) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a94474d0-2426-4127-a5e2-6acdc843e5f4)) (pad "C1" smd circle (at -0.4 0.4) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2b7fc8bf-3f05-407b-92c2-b24d438699d4)) (pad "C2" smd circle (at 0 0.4) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ad8c57ab-0ebb-49c2-bf00-802780658d42)) (pad "C3" smd circle (at 0.4 0.4) (size 0.27 0.27) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 479c6ea3-649e-4542-96fe-9d088884ef83)) (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/WLP-9_1.448x1.468mm_Layout3x3_P0.4mm_Ball0.27mm_Pad0.25mm.wrl" (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )