(footprint "LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm_ThermalVias" (version 20211014) (generator pcbnew)
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  (tedit 5EAC5A50)
  (descr "LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_21.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
  (tags "LFCSP NoLead")
  (attr smd)
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    (tstamp fdec702a-19cf-488e-b2e4-93c74b9d96b5)
  )
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  (pad "12" smd roundrect (at 1.4375 -0.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp eee2e4ae-4641-479f-9e83-dd5ece35e4dc))
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  (pad "16" smd roundrect (at -0.75 -1.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 9ea8ad89-57df-4fb4-a0b0-e19f0cf0aabe))
  (pad "17" thru_hole circle (at 0.35 -0.35) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 03682cee-26b7-4ff6-b14c-963133b3e0d5))
  (pad "17" smd rect (at 0 0) (size 1.3 1.3) (layers "F.Cu" "F.Mask") (tstamp 510000d9-4d17-4060-951b-7bc394679a78))
  (pad "17" smd rect (at 0 0) (size 1.3 1.3) (layers "B.Cu") (tstamp 700224fa-37bb-42a5-8dc6-dcb4e2722268))
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  (pad "17" thru_hole circle (at -0.35 0.35) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp c10c1cd8-e03e-49c9-b7d8-a530f0c66451))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/LFCSP-16-1EP_3x3mm_P0.5mm_EP1.3x1.3mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)