(footprint "LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5DC5F696)
  (descr "LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
  (tags "LFCSP NoLead")
  (attr smd)
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    (tstamp 28424d8b-7297-4ef4-b7bd-74ab8899865d)
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  (pad "" smd roundrect (at -0.4 -0.4) (size 0.69 0.69) (layers "F.Paste") (roundrect_rratio 0.25) (tstamp 24f394fc-3431-4421-8298-17c8ce13bb8b))
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  (pad "12" smd roundrect (at 1.4375 -0.75) (size 0.875 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 36a1d5cd-bda7-4871-afe7-99f30ef516b9))
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  (pad "14" smd roundrect (at 0.25 -1.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6dd67080-079e-412a-b2f8-5a296d527616))
  (pad "15" smd roundrect (at -0.25 -1.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp e761ad3c-bced-449e-95ff-0f082533c652))
  (pad "16" smd roundrect (at -0.75 -1.4375) (size 0.25 0.875) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp f735c08b-514d-4375-96db-1f821ff227db))
  (pad "17" thru_hole circle (at 0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 3e1fcd07-403d-4a4e-88d2-62e476055a63))
  (pad "17" thru_hole circle (at 0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 5b56f27b-4ef6-489c-84e6-da559c1f365c))
  (pad "17" thru_hole circle (at -0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 6cc21e8f-3346-4a99-9d7d-ecad33504a9b))
  (pad "17" thru_hole circle (at -0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 9585e778-04d2-4c93-9b78-f1426a192d3e))
  (pad "17" smd rect (at 0 0) (size 1.6 1.6) (layers "B.Cu") (tstamp a939f24e-2743-4f70-9726-350696b3eb5e))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)