(footprint "LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm_ThermalVias" (version 20211014) (generator pcbnew)
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  (pad "25" smd rect (at 0 0) (size 2.5 2.5) (layers "B.Cu") (tstamp 6e6761de-cf2a-4008-affe-0988131825b1))
  (pad "25" thru_hole circle (at 0 -1) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp 71547071-9742-4891-b21a-5a299244a2bd))
  (pad "25" thru_hole circle (at -1 1) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp 98e7de55-0055-45a5-a055-c25efe91603b))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/LFCSP-24-1EP_4x4mm_P0.5mm_EP2.5x2.5mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
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)