(footprint "ST_WLCSP-180_Die451" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf")
  (tags "BGA 180 0.4")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 63dde1d7-b020-4c0d-85a0-9e962039707b)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 20afeaf0-3eea-4c75-bcc6-5c8a39844f3f)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 67586c90-3e40-4fea-9dc2-6067fa2d53d7)
  )
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  (pad "N3" smd circle (at -1.6 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e647fb8f-a83d-4cf1-8272-cf0dbed578f1))
  (pad "N4" smd circle (at -1.2 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e1ed9bee-16f8-4e5e-b308-fc50bdc9bf4b))
  (pad "N5" smd circle (at -0.8 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ef89424a-bd11-460e-a430-fd71abb65f46))
  (pad "N6" smd circle (at -0.4 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 48cccbf6-2d8d-4a7f-a34b-f9e923469671))
  (pad "N7" smd circle (at 0 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 13c5546f-b29f-4406-b36f-a5b160e818c3))
  (pad "N8" smd circle (at 0.4 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e2dc2d82-dc8d-4055-adf9-34d9a76a2115))
  (pad "N9" smd circle (at 0.8 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5e3a3b02-07e4-430b-98c5-c768bfd1539b))
  (pad "N10" smd circle (at 1.2 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f5092b8c-8263-40fc-92ec-037c4fd2df93))
  (pad "N11" smd circle (at 1.6 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 74681f3a-ae27-437a-81e2-01ed3f7c0273))
  (pad "N12" smd circle (at 2 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 7c1a5f84-0a5f-4145-82cc-3294bb9147c7))
  (pad "N13" smd circle (at 2.4 2.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0e7b4553-6429-4d55-8b65-e631233fb4c0))
  (pad "P1" smd circle (at -2.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3d5055fd-56e4-4ea6-b7a5-5eece32d0863))
  (pad "P2" smd circle (at -2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp dc939f2b-9e4c-43b9-860d-06c70c91b3db))
  (pad "P3" smd circle (at -1.6 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e70a04b9-7823-4cbb-acb2-1ecf6a1869f4))
  (pad "P4" smd circle (at -1.2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 291c160f-efa3-42dd-882f-c4abb890dc7c))
  (pad "P5" smd circle (at -0.8 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 47e1c562-b402-42c3-903b-c5042ff5198d))
  (pad "P6" smd circle (at -0.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6ba22c24-936c-4d3a-b6a1-991fc90fe2fb))
  (pad "P7" smd circle (at 0 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 1b13a0c3-43b8-4b71-bc50-8dba256a3a9a))
  (pad "P8" smd circle (at 0.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8712d338-5521-4099-831d-65831deea2ab))
  (pad "P9" smd circle (at 0.8 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 351a13f6-d696-481b-ac9e-6561ddfa8111))
  (pad "P10" smd circle (at 1.2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 2b43a5e8-2140-46bf-b3cb-52d22952bb17))
  (pad "P11" smd circle (at 1.6 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c1628d44-58ee-4f26-bd5f-fe96c84cb49f))
  (pad "P12" smd circle (at 2 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0579f813-3c54-4389-b1cc-7f26a0041938))
  (pad "P13" smd circle (at 2.4 2.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 7ef19716-8188-4fad-b06f-c397f3e3ccff))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-180_Die451.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)