(footprint "ST_WLCSP-25_Die444" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf")
  (tags "BGA 25 0.4")
  (attr smd)
  (fp_text reference "REF**" (at 0 -2.1625) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 98322467-1ef2-4d0d-9c1a-4a735058aafd)
  )
  (fp_text value "ST_WLCSP-25_Die444" (at 0 2.1625) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp a18e9ee2-4691-4851-bc62-c29d0e9c3dca)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.56 0.56) (thickness 0.084)))
    (tstamp 521c3a6e-a79d-4a47-884f-4832bd74532a)
  )
  (fp_line (start -1.3365 1.2875) (end -1.3365 -0.70625) (layer "F.SilkS") (width 0.12) (tstamp 19d5d5e6-69e1-4432-a762-50643b515feb))
  (fp_line (start 1.3365 1.2875) (end -1.3365 1.2875) (layer "F.SilkS") (width 0.12) (tstamp 9f1e0c89-fe06-4b53-9758-35fa085a0218))
  (fp_line (start 1.3365 -1.2875) (end 1.3365 1.2875) (layer "F.SilkS") (width 0.12) (tstamp a2773247-2026-4d5e-9a1f-a6b244fbb153))
  (fp_line (start -0.75525 -1.2875) (end 1.3365 -1.2875) (layer "F.SilkS") (width 0.12) (tstamp d2cff6f3-17eb-4859-95d8-3fa8b23e0227))
  (fp_line (start -2.22 -2.17) (end -2.22 2.17) (layer "F.CrtYd") (width 0.05) (tstamp 1818616e-1b24-422d-a84a-3babf6e70690))
  (fp_line (start -2.22 2.17) (end 2.22 2.17) (layer "F.CrtYd") (width 0.05) (tstamp 6990939f-e92b-431c-b910-30fe54467d1b))
  (fp_line (start 2.22 -2.17) (end -2.22 -2.17) (layer "F.CrtYd") (width 0.05) (tstamp 764991e7-627c-48e5-9efe-cf1ee4b994a2))
  (fp_line (start 2.22 2.17) (end 2.22 -2.17) (layer "F.CrtYd") (width 0.05) (tstamp a6d86d4c-51d6-40cd-bf23-fde11b51e1ee))
  (fp_line (start -0.63025 -1.1625) (end 1.2115 -1.1625) (layer "F.Fab") (width 0.1) (tstamp 59098b8e-fcc8-4686-868f-b329c7a34c0f))
  (fp_line (start -1.2115 -0.58125) (end -0.63025 -1.1625) (layer "F.Fab") (width 0.1) (tstamp 73c4a5cb-63ba-4873-9afc-4c3a22f890ca))
  (fp_line (start -1.2115 1.1625) (end -1.2115 -0.58125) (layer "F.Fab") (width 0.1) (tstamp 7beaae17-215d-46a5-9dbf-29ccd9785c0f))
  (fp_line (start 1.2115 1.1625) (end -1.2115 1.1625) (layer "F.Fab") (width 0.1) (tstamp e1be6f19-ba9b-4b55-9297-5e948fda151a))
  (fp_line (start 1.2115 -1.1625) (end 1.2115 1.1625) (layer "F.Fab") (width 0.1) (tstamp e88a18d8-16a6-4b73-92d2-5327385c2133))
  (pad "A1" smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d3390de3-06c6-45a0-ae6b-dc5f3e33be9d))
  (pad "A2" smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0da2a2ce-fdf4-4d05-ac55-f82f2e5eb7b8))
  (pad "A3" smd circle (at 0 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 72ca12c2-930b-48a4-8fd4-68c6d4383e98))
  (pad "A4" smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp dc865b8b-57bf-44f2-b5f3-134b38f3a2ff))
  (pad "A5" smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3835c854-17f2-4ec6-8222-849745c6e4b1))
  (pad "B1" smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5fde1945-b084-4f21-adbc-2a3856ee6250))
  (pad "B2" smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp aaeb12ba-7535-409f-b1d8-ed60ba7464bc))
  (pad "B3" smd circle (at 0 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 2cc22994-348f-4d99-bd58-71478173f355))
  (pad "B4" smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp bd457a4f-c4cf-48b1-a3f1-2e656e78bbd7))
  (pad "B5" smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f69001e4-fea1-4f6c-b30d-b62cb64a2fdb))
  (pad "C1" smd circle (at -0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6e286a93-2e83-4251-9c2b-5bd01b0c83d4))
  (pad "C2" smd circle (at -0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0f26b1ad-4712-4d60-a3c4-05e9f1be451c))
  (pad "C3" smd circle (at 0 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8f590c7c-1e86-47b2-895a-aa2652aa02e8))
  (pad "C4" smd circle (at 0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4540248a-1956-45ca-a2e1-227465fcc4ee))
  (pad "C5" smd circle (at 0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d851a18f-f4e0-4f77-b2f3-c1950c089ee2))
  (pad "D1" smd circle (at -0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 9bc38fa3-a8be-46fe-a331-80a535bece09))
  (pad "D2" smd circle (at -0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp fbf4677c-b38a-48c8-8107-216b1a9a252f))
  (pad "D3" smd circle (at 0 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 07773a57-59ca-442b-8762-83748e2dd0e5))
  (pad "D4" smd circle (at 0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 762c50da-1b99-40b5-aa70-1b6dc4bfd678))
  (pad "D5" smd circle (at 0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp a2ce7ebd-971c-4efa-998e-196d0cde2b3e))
  (pad "E1" smd circle (at -0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e9601177-0e7d-4c40-b97c-5ea8362d07d2))
  (pad "E2" smd circle (at -0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 96374d5c-8df4-4ca4-9ccc-9b40ea9d3ccb))
  (pad "E3" smd circle (at 0 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b9acf92e-3f57-4572-bee9-328263895929))
  (pad "E4" smd circle (at 0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 280d4d6b-2c15-456e-a77a-5723ad255fe9))
  (pad "E5" smd circle (at 0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 32d5acb5-7047-437c-b411-f233a536a30a))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-25_Die444.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)