(footprint "ST_WLCSP-25_Die457" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf")
  (tags "BGA 25 0.4")
  (attr smd)
  (fp_text reference "REF**" (at 0 -2.035) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 6a079a4d-701f-42c4-9fa0-270934d001b3)
  )
  (fp_text value "ST_WLCSP-25_Die457" (at 0 2.035) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 41ae4d50-6db4-44c8-96a8-af6d24891242)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.5 0.5) (thickness 0.075)))
    (tstamp edeaa4b7-a93a-4232-84e4-9b697d5a5a64)
  )
  (fp_line (start 1.1915 1.16) (end -1.1915 1.16) (layer "F.SilkS") (width 0.12) (tstamp 5c420542-190f-4942-8217-c75dc34867d7))
  (fp_line (start 1.1915 -1.16) (end 1.1915 1.16) (layer "F.SilkS") (width 0.12) (tstamp 7f6191cb-2b93-4f21-b32f-96312c904dcc))
  (fp_line (start -1.1915 1.16) (end -1.1915 -0.6425) (layer "F.SilkS") (width 0.12) (tstamp a48d6a7b-a9ce-4d84-8ec2-fd4598058f12))
  (fp_line (start -0.674 -1.16) (end 1.1915 -1.16) (layer "F.SilkS") (width 0.12) (tstamp d4f0ca02-6954-454a-af20-2f050a214436))
  (fp_line (start -2.07 2.04) (end 2.07 2.04) (layer "F.CrtYd") (width 0.05) (tstamp 4b3fdfc9-4878-4b96-a8e9-19582cbad147))
  (fp_line (start 2.07 -2.04) (end -2.07 -2.04) (layer "F.CrtYd") (width 0.05) (tstamp 78ee841e-dbe4-426a-8487-bb38dd876f37))
  (fp_line (start 2.07 2.04) (end 2.07 -2.04) (layer "F.CrtYd") (width 0.05) (tstamp a8f62bca-ed0d-4379-9ea6-373ca6440ba9))
  (fp_line (start -2.07 -2.04) (end -2.07 2.04) (layer "F.CrtYd") (width 0.05) (tstamp faff409e-74cc-472d-95d1-97e925fb26d9))
  (fp_line (start 1.0665 -1.035) (end 1.0665 1.035) (layer "F.Fab") (width 0.1) (tstamp 47d3374d-d4b3-4a22-b0b9-9f26c3ba44e7))
  (fp_line (start -1.0665 -0.5175) (end -0.549 -1.035) (layer "F.Fab") (width 0.1) (tstamp 5fa12569-fd07-4e9a-bcb4-f7330552119a))
  (fp_line (start -0.549 -1.035) (end 1.0665 -1.035) (layer "F.Fab") (width 0.1) (tstamp 70cee082-0863-4ccb-ae9a-8190d9843978))
  (fp_line (start 1.0665 1.035) (end -1.0665 1.035) (layer "F.Fab") (width 0.1) (tstamp e822a28e-b034-42eb-bf52-9adaaffafdec))
  (fp_line (start -1.0665 1.035) (end -1.0665 -0.5175) (layer "F.Fab") (width 0.1) (tstamp fb61de1f-d665-4695-9e7f-0f0755ac6cd3))
  (pad "A1" smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 27c624f2-f2ea-4d8c-bcd7-f6c78fb7074b))
  (pad "A2" smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 64e0935e-e2d1-41ba-a891-d540d6b4f4a1))
  (pad "A3" smd circle (at 0 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 37e09162-252e-4b6b-8d01-cde02b00172f))
  (pad "A4" smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6bb5d223-033d-4735-8686-0853464e7f09))
  (pad "A5" smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c80b0864-4b20-4ae2-8f33-8046c568d8ae))
  (pad "B1" smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 40a65f35-aeaf-4a24-90ff-867b6fe7ece8))
  (pad "B2" smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b58cc4e3-cc11-4ffd-9dae-d8039f794c2e))
  (pad "B3" smd circle (at 0 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8e87c765-e38e-4321-8907-4f05310b216c))
  (pad "B4" smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d3274255-33a5-4349-81f2-9898f878a454))
  (pad "B5" smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp be86d375-5df8-49cb-ae55-a76bbda1ab39))
  (pad "C1" smd circle (at -0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ac6bad90-c397-40d3-b119-46b3b9139485))
  (pad "C2" smd circle (at -0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ab5b934c-bccc-4f75-8d40-88424d8078c9))
  (pad "C3" smd circle (at 0 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 70fefd8a-1eaf-4509-b04b-ecb5a4912485))
  (pad "C4" smd circle (at 0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 56dc416f-de12-40c6-8774-949d1f37a22c))
  (pad "C5" smd circle (at 0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 78f7ab9a-8203-461d-82b3-a634aa196d67))
  (pad "D1" smd circle (at -0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 9c934422-18fd-4a58-b1a9-f9a90623807f))
  (pad "D2" smd circle (at -0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5f8b5347-7aa1-4c2c-b987-2a235438beb1))
  (pad "D3" smd circle (at 0 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ea4f3533-902e-4c75-a9db-76efae89aadc))
  (pad "D4" smd circle (at 0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 447efbdc-f70f-4886-bd38-8c9caaaf4ff8))
  (pad "D5" smd circle (at 0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 98d35e49-789d-4822-8421-37ced4a24b8a))
  (pad "E1" smd circle (at -0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e7650ad2-f54a-4585-a123-51e362090f41))
  (pad "E2" smd circle (at -0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp eec088f2-ad95-45cb-b22a-08f16846e3f7))
  (pad "E3" smd circle (at 0 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5b0ed9aa-ced8-4a87-8fcc-bfd8c3974e94))
  (pad "E4" smd circle (at 0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5d2728b3-f7cc-4762-811f-7b5204b87f2a))
  (pad "E5" smd circle (at 0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e2ed77dc-83e0-484e-bfd6-4aacce9de8c5))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-25_Die457.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)