(footprint "ST_WLCSP-36_Die458" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf")
  (tags "BGA 36 0.4")
  (attr smd)
  (fp_text reference "REF**" (at 0 -2.2895) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 86297ab6-6cfa-4709-b7e2-f37824c86ae3)
  )
  (fp_text value "ST_WLCSP-36_Die458" (at 0 2.2895) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 767492f2-7a19-43d2-8a29-d8598a7c7f1e)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.59 0.59) (thickness 0.0885)))
    (tstamp 9cea485f-465f-49ae-b3ad-258bb946603c)
  )
  (fp_line (start -1.4015 1.4145) (end -1.4015 -0.77625) (layer "F.SilkS") (width 0.12) (tstamp 063a3df5-908d-444d-a517-e03257fc54d6))
  (fp_line (start 1.4015 1.4145) (end -1.4015 1.4145) (layer "F.SilkS") (width 0.12) (tstamp 42021e8e-cf3a-47ef-868d-8ae7605e83b8))
  (fp_line (start 1.4015 -1.4145) (end 1.4015 1.4145) (layer "F.SilkS") (width 0.12) (tstamp 8d04dc32-7523-485f-8154-90be36446389))
  (fp_line (start -0.76325 -1.4145) (end 1.4015 -1.4145) (layer "F.SilkS") (width 0.12) (tstamp bcca27f0-1032-4b6e-be8c-ae82b0f5d8ac))
  (fp_line (start -2.28 -2.29) (end -2.28 2.29) (layer "F.CrtYd") (width 0.05) (tstamp 4782ee5e-f659-4d46-a08a-434976438d9e))
  (fp_line (start 2.28 -2.29) (end -2.28 -2.29) (layer "F.CrtYd") (width 0.05) (tstamp 560de2bc-10fa-40ee-99b4-51adabdc0d18))
  (fp_line (start 2.28 2.29) (end 2.28 -2.29) (layer "F.CrtYd") (width 0.05) (tstamp b48b9b69-3536-4664-ab09-66ff4d7f0120))
  (fp_line (start -2.28 2.29) (end 2.28 2.29) (layer "F.CrtYd") (width 0.05) (tstamp dd27b297-0740-4596-8b44-5ae61ccf5c42))
  (fp_line (start -1.2765 -0.65125) (end -0.63825 -1.2895) (layer "F.Fab") (width 0.1) (tstamp 212aabd2-75cf-4c87-9615-964189c54252))
  (fp_line (start -0.63825 -1.2895) (end 1.2765 -1.2895) (layer "F.Fab") (width 0.1) (tstamp 708dedc6-7c10-4840-9101-f8b20ddae1e2))
  (fp_line (start 1.2765 1.2895) (end -1.2765 1.2895) (layer "F.Fab") (width 0.1) (tstamp 71238c28-55b4-4461-9966-f8d67e025cb1))
  (fp_line (start -1.2765 1.2895) (end -1.2765 -0.65125) (layer "F.Fab") (width 0.1) (tstamp ac8975cb-a3f0-4b76-a64b-c126f07c4783))
  (fp_line (start 1.2765 -1.2895) (end 1.2765 1.2895) (layer "F.Fab") (width 0.1) (tstamp e2e9ea33-869e-43d2-96f4-b2216039be65))
  (pad "A1" smd circle (at -1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 1e0827dd-889b-4092-9ece-63db79211bfa))
  (pad "A2" smd circle (at -0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3f84898a-f602-4d69-8974-e6081716cba4))
  (pad "A3" smd circle (at -0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0ea9d0a4-7c2f-4e72-8473-df04d8fbb02d))
  (pad "A4" smd circle (at 0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d2bc33be-5788-47ba-9ac2-c46c50dac62a))
  (pad "A5" smd circle (at 0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c344ed81-9723-472f-bb0c-19c50ff5e4b7))
  (pad "A6" smd circle (at 1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 690daae3-7e88-4c75-b640-1ec758013a07))
  (pad "B1" smd circle (at -1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c6152d6c-92ea-4d5a-b9b2-c32e89605d7a))
  (pad "B2" smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5da801ca-ae5a-4a9c-8963-248422804c87))
  (pad "B3" smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp fc7e2ba2-f101-4311-9c72-bfdb976d6db5))
  (pad "B4" smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 569fcea9-6634-4ff5-8637-960037b039f4))
  (pad "B5" smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b75a4d3c-90f8-4ba7-b49f-517f039d8a04))
  (pad "B6" smd circle (at 1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5e2243b2-a53c-4873-b07d-817210a230f1))
  (pad "C1" smd circle (at -1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp fc66710f-aeb5-409c-87f6-b4767952bd26))
  (pad "C2" smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 84f08cc3-0a86-4fe1-be4f-4f840888353c))
  (pad "C3" smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 59dde403-2be9-473a-9b41-4cdafec750a2))
  (pad "C4" smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f098d3ba-8836-4efb-ac6c-0844d4fbb139))
  (pad "C5" smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c8277f47-87d7-4696-a037-8bc478daaf9d))
  (pad "C6" smd circle (at 1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 7180cb8f-0d09-4f48-8dc6-1511370b72f3))
  (pad "D1" smd circle (at -1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 76f192ef-3fa5-439c-bfa2-9e05988bac8c))
  (pad "D2" smd circle (at -0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 814906b7-e8f9-4cc9-989e-3ad9c0628a6d))
  (pad "D3" smd circle (at -0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ed4586f6-bb47-4a58-8df7-af1b4520b939))
  (pad "D4" smd circle (at 0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 655585c8-e28d-4af0-9b99-1750e1fbc0e1))
  (pad "D5" smd circle (at 0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ff6ecc55-e873-47e6-8923-4a9cc941576f))
  (pad "D6" smd circle (at 1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6f9a25ae-7178-4d7c-b4b1-3ba2034beeaf))
  (pad "E1" smd circle (at -1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp cfeb876d-5425-4048-b093-e98db0236b60))
  (pad "E2" smd circle (at -0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5ee8b5ed-79a2-4e94-bafd-a0fcace1bb82))
  (pad "E3" smd circle (at -0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp a8751b3c-f957-4a62-8db1-f0139f35018e))
  (pad "E4" smd circle (at 0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 539ce6bd-52b1-4875-a291-e13aceaf5950))
  (pad "E5" smd circle (at 0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 97229ce2-61a1-4aa2-afc5-33be50e54567))
  (pad "E6" smd circle (at 1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8dbcd0e4-5f26-4592-a4f5-cf9ade7c02f5))
  (pad "F1" smd circle (at -1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 9bb2c757-b79d-4715-9970-733c6a9c9adf))
  (pad "F2" smd circle (at -0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8b362836-62fb-40d6-8bf2-cfa65f2d5bae))
  (pad "F3" smd circle (at -0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 44997414-7516-4c8c-9210-b589c0ffb48d))
  (pad "F4" smd circle (at 0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp bc24ebbb-f8f5-4236-aa33-f6e0a9da8cdb))
  (pad "F5" smd circle (at 0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3e3dfd4d-ba49-4f44-88ee-4a0be39987ff))
  (pad "F6" smd circle (at 1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0d34ee5c-3274-4e74-b1ee-80af8c46f785))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-36_Die458.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)