(footprint "ST_WLCSP-63_Die427" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf")
  (tags "BGA 63 0.4")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 0071b638-66f5-4cd4-9188-f10c48c7f077)
  )
  (fp_text value "ST_WLCSP-63_Die427" (at 0 3.082) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp fcf74338-d545-4aa5-b8d3-61385c907ba9)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.75 0.75) (thickness 0.1125)))
    (tstamp 84f89231-bf6a-41b6-929d-f0a9de34aba8)
  )
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  (pad "J3" smd circle (at -0.4 1.6) (size 0.24 0.24) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5bff8b69-08ab-44e8-9e54-f870b9c6cfdd))
  (pad "J4" smd circle (at 0 1.6) (size 0.24 0.24) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3df4c443-f4ef-4244-9e14-854c45bcf892))
  (pad "J5" smd circle (at 0.4 1.6) (size 0.24 0.24) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3dd83864-0371-4495-9d71-b9776522eee0))
  (pad "J6" smd circle (at 0.8 1.6) (size 0.24 0.24) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a3847012-a9ae-4647-91d5-79b86236fbe6))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-63_Die427.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)