(footprint "ST_WLCSP-64_Die427" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf")
  (tags "BGA 64 0.4")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 4f019947-3d54-4651-8586-e725517451df)
  )
  (fp_text value "ST_WLCSP-64_Die427" (at 0 3.4555) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp fa589484-5cd6-44d4-84f8-834ff8c04d95)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 3825fb44-bd35-49bb-b2e8-2076429020b4)
  )
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  (pad "H4" smd circle (at -0.2 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5d42750d-dcd0-45bc-972b-6a68e72dd6d1))
  (pad "H5" smd circle (at 0.2 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp efde8c8f-9375-4ba4-9140-abe8451aab08))
  (pad "H6" smd circle (at 0.6 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fa42eaec-f7a7-49a4-940c-35f5dc7e7f1c))
  (pad "H7" smd circle (at 1 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 64d538c8-dfe3-4541-bedd-a35b7592949a))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-64_Die427.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)