(footprint "ST_WLCSP-64_Die436" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf")
  (tags "BGA 64 0.4")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 55475a2e-fa9b-43f6-b3ea-d4d04c9af357)
  )
  (fp_text value "ST_WLCSP-64_Die436" (at 0 3.4555) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b1c16a50-7c86-4cbb-a257-737a1cf102e4)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 19e939a4-588d-4906-a9d6-11fd275bd774)
  )
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  (pad "H4" smd circle (at -0.2 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4749774e-9942-46b0-9772-ff14bab2f038))
  (pad "H5" smd circle (at 0.2 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 50095c5d-b624-4435-b551-b19aef636d73))
  (pad "H6" smd circle (at 0.6 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 190a6861-eea5-4a16-899c-5695e2822c7b))
  (pad "H7" smd circle (at 1 1.4) (size 0.22 0.22) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 80db6a33-66e5-4db3-b4ce-18013404de5a))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-64_Die436.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)