(footprint "ST_WLCSP-64_Die441" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf")
  (tags "BGA 64 0.4")
  (attr smd)
  (fp_text reference "REF**" (at 0 -2.8255) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp e57a9cfb-b62b-474a-bb39-0b9694955c24)
  )
  (fp_text value "ST_WLCSP-64_Die441" (at 0 2.8255) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 04dad057-194b-4274-9a01-0c1eb63d7b4e)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.84 0.84) (thickness 0.126)))
    (tstamp 4007b1fd-965e-42f2-b033-125da87c69dc)
  )
  (fp_line (start 1.9365 -1.9505) (end 1.9365 1.9505) (layer "F.SilkS") (width 0.12) (tstamp 74f58dfd-ca72-4e61-93e3-1971b0097f0f))
  (fp_line (start -1.9365 1.9505) (end -1.9365 -1.04475) (layer "F.SilkS") (width 0.12) (tstamp 9f996c68-b08a-424e-9578-e7df51fba6e7))
  (fp_line (start -1.03075 -1.9505) (end 1.9365 -1.9505) (layer "F.SilkS") (width 0.12) (tstamp bffcaaf1-2395-47aa-8ea9-dfce0822a02f))
  (fp_line (start 1.9365 1.9505) (end -1.9365 1.9505) (layer "F.SilkS") (width 0.12) (tstamp d42db831-5b14-4a15-bbb7-a72e82bdf90a))
  (fp_line (start 2.82 -2.83) (end -2.82 -2.83) (layer "F.CrtYd") (width 0.05) (tstamp 37d6f61f-9bf9-4ca8-9f00-4214b1728396))
  (fp_line (start -2.82 2.83) (end 2.82 2.83) (layer "F.CrtYd") (width 0.05) (tstamp 54f5cbbf-fd30-45fa-ac98-415849a7923f))
  (fp_line (start 2.82 2.83) (end 2.82 -2.83) (layer "F.CrtYd") (width 0.05) (tstamp 83804e34-9986-44f1-9e25-e4a924733444))
  (fp_line (start -2.82 -2.83) (end -2.82 2.83) (layer "F.CrtYd") (width 0.05) (tstamp a51acfc2-9106-44d4-ba4c-45522c02bf13))
  (fp_line (start 1.8115 -1.8255) (end 1.8115 1.8255) (layer "F.Fab") (width 0.1) (tstamp 7427e9bc-fe21-4132-b326-03a65feb0068))
  (fp_line (start -1.8115 -0.91975) (end -0.90575 -1.8255) (layer "F.Fab") (width 0.1) (tstamp abb4df06-dddd-4f93-b2ec-2e87371779e7))
  (fp_line (start 1.8115 1.8255) (end -1.8115 1.8255) (layer "F.Fab") (width 0.1) (tstamp b3c1a193-2bc5-4cfb-8560-2fa742f172f7))
  (fp_line (start -0.90575 -1.8255) (end 1.8115 -1.8255) (layer "F.Fab") (width 0.1) (tstamp cd054a03-37ba-474b-ba36-08c68202fa0c))
  (fp_line (start -1.8115 1.8255) (end -1.8115 -0.91975) (layer "F.Fab") (width 0.1) (tstamp f5d86745-6cb6-4847-959b-2d93680b0c4a))
  (pad "A1" smd circle (at -1.4 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e4fe85db-ff56-4c48-859d-b844b46270f0))
  (pad "A2" smd circle (at -1 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c0b72425-5dc4-4d16-8317-bb3928336bb4))
  (pad "A3" smd circle (at -0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 40927f47-b6c1-442d-adf4-fdfac7ffacc8))
  (pad "A4" smd circle (at -0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f95fd5a6-9a6d-42f1-a45d-42991311c0b8))
  (pad "A5" smd circle (at 0.2 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3aaa0e5f-aad0-4e78-8526-beae90097e66))
  (pad "A6" smd circle (at 0.6 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b6aefccc-d6c2-4d06-9af2-2e0426cfe226))
  (pad "A7" smd circle (at 1 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5b0b9f9a-5de5-4f7e-bb23-28c90c57c0b2))
  (pad "A8" smd circle (at 1.4 -1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 9280c929-01fe-49f6-83a4-628c4072245f))
  (pad "B1" smd circle (at -1.4 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b64b08d6-ef5f-4d46-9b48-17dacc660796))
  (pad "B2" smd circle (at -1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp a0da07b3-31cf-44fc-931d-d4005b294c25))
  (pad "B3" smd circle (at -0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 567653a3-4744-4908-9b06-a69fdcd1fd13))
  (pad "B4" smd circle (at -0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 19de9f9b-5da2-4c04-8563-b02c2d437f25))
  (pad "B5" smd circle (at 0.2 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c28a1ed8-17a1-4561-83d4-72440e19b8c2))
  (pad "B6" smd circle (at 0.6 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp da9360e7-4a33-4d0b-a17f-82e6b1581f6e))
  (pad "B7" smd circle (at 1 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 654a6755-1941-4660-bcce-57a457fb41e3))
  (pad "B8" smd circle (at 1.4 -1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 882c2660-14a9-4cba-8ed8-954ddeb743dd))
  (pad "C1" smd circle (at -1.4 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f89ae3b7-fda9-404e-a708-d34976b60b32))
  (pad "C2" smd circle (at -1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp dfa3361e-e4da-48b4-88c0-f26167a19436))
  (pad "C3" smd circle (at -0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 843e590a-0aa8-49b4-b157-1c8490b95dc1))
  (pad "C4" smd circle (at -0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b8bc7310-29af-4051-8d0b-3bd92b4a8196))
  (pad "C5" smd circle (at 0.2 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d4c0690e-81da-4d92-8c6a-4bd2c9cf4a98))
  (pad "C6" smd circle (at 0.6 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 816f5e2e-e573-4ae4-ab35-7c418f471ab2))
  (pad "C7" smd circle (at 1 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp fd76bdc1-ee86-43c4-bb4c-a462d505c4c8))
  (pad "C8" smd circle (at 1.4 -0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 91fe23e2-044f-4eaf-b44c-888c25e98bf7))
  (pad "D1" smd circle (at -1.4 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c382914a-22c2-4f27-83ba-e00415dc01f7))
  (pad "D2" smd circle (at -1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp cdfcf6b0-dbd5-46d2-a10b-c77fc656a227))
  (pad "D3" smd circle (at -0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6d300dae-0969-47ef-9c3f-9e8a49aa14af))
  (pad "D4" smd circle (at -0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4adc9878-b7b5-4bf0-926c-761f93f9be53))
  (pad "D5" smd circle (at 0.2 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 1a8cf54f-860b-496a-9f55-a8bdf2405bfd))
  (pad "D6" smd circle (at 0.6 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp b1901c61-66ae-4d8e-b99a-02efe3bb6433))
  (pad "D7" smd circle (at 1 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e7d92170-7cb8-4bdc-9aea-1d9373842561))
  (pad "D8" smd circle (at 1.4 -0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d1d0f27a-fcc8-432f-aee2-9c53c0d104d1))
  (pad "E1" smd circle (at -1.4 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d242baff-dd30-4410-80e9-1287d0f295b9))
  (pad "E2" smd circle (at -1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 631e13df-adff-465b-93a4-f2d1e30f41b5))
  (pad "E3" smd circle (at -0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 7b91ffbb-123e-4fdf-bdfe-64f1d1f8b3a0))
  (pad "E4" smd circle (at -0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6b1d3258-a362-44aa-b61a-871a870737ad))
  (pad "E5" smd circle (at 0.2 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4847748f-7b05-4860-840a-f616bc616c11))
  (pad "E6" smd circle (at 0.6 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e77409e7-3cbb-4763-b892-a585da2e151a))
  (pad "E7" smd circle (at 1 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 98bfd653-8a09-4b7c-9ecc-695415233e66))
  (pad "E8" smd circle (at 1.4 0.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f5514f39-eee0-4202-a722-7c454df4df91))
  (pad "F1" smd circle (at -1.4 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 5aae4749-815a-4f7c-a39a-ebfb39877f37))
  (pad "F2" smd circle (at -1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4c0c99b5-0f50-43fd-b22d-b17636ec08de))
  (pad "F3" smd circle (at -0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 4ea8772d-3cfb-447c-ae89-bac2ca22ada0))
  (pad "F4" smd circle (at -0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 69d445d9-b1d5-4e35-aa31-f21605d07b64))
  (pad "F5" smd circle (at 0.2 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp a60e9232-954c-4adf-9f1a-c5598d74919f))
  (pad "F6" smd circle (at 0.6 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp f1dc47ac-3c45-4bf0-9c26-84be9ba2b96c))
  (pad "F7" smd circle (at 1 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 3b13e027-6338-41d1-b6b4-62d629c28cc5))
  (pad "F8" smd circle (at 1.4 0.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 492ecc33-2434-4246-a6b2-c2e46cfdff53))
  (pad "G1" smd circle (at -1.4 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp cbe05e51-d9af-45e6-9e4f-241468341d90))
  (pad "G2" smd circle (at -1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp fbd72b2e-de8d-4c2c-ba84-6e9feb1070fd))
  (pad "G3" smd circle (at -0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 2ce8acf5-a45b-448c-ae55-f968d189c49f))
  (pad "G4" smd circle (at -0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 0c798dd0-d960-437c-889a-24cdb168e308))
  (pad "G5" smd circle (at 0.2 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp e93f58e5-72b7-4974-871e-b968e57d8342))
  (pad "G6" smd circle (at 0.6 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 21cfc92a-c3e5-4eb4-8976-1222dcb2d9df))
  (pad "G7" smd circle (at 1 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 99ae66ac-8098-4c96-a787-313835d83ca2))
  (pad "G8" smd circle (at 1.4 1) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 001324e8-afdb-4f05-a545-f17171e765a8))
  (pad "H1" smd circle (at -1.4 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 8afb2837-436f-4d28-be9c-83298248143c))
  (pad "H2" smd circle (at -1 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp c5ed23c6-f51f-423b-80e2-fd1df460c118))
  (pad "H3" smd circle (at -0.6 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp a18ca99f-f554-402f-92d3-9576419e0b0e))
  (pad "H4" smd circle (at -0.2 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 6c51ea6d-c737-414f-b71e-54374f73d5f9))
  (pad "H5" smd circle (at 0.2 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp a088f351-d5ac-4dd3-9d76-ff729600b38d))
  (pad "H6" smd circle (at 0.6 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 32e93dc5-52f3-4c76-85cb-17b4ac0babe2))
  (pad "H7" smd circle (at 1 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp ac04357d-1226-4ad0-a994-f775d220baf1))
  (pad "H8" smd circle (at 1.4 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 443d377a-939f-4a19-af87-24f975b86514))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-64_Die441.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)