(footprint "ST_WLCSP-64_Die462" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf")
  (tags "BGA 64 0.4")
  (attr smd)
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    (tstamp d53ae5c7-cf16-48b1-9733-03f2d1991a49)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp db664211-4ec9-4945-9ee1-18acfa571a6f)
  )
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    (effects (font (size 0.78 0.78) (thickness 0.117)))
    (tstamp 45289c01-9893-4e97-8d4c-ee6624a8e1dc)
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  (pad "H7" smd circle (at 1 1.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 44925905-669c-423c-9c11-4f74e981031c))
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    (solder_paste_margin_ratio 0.055556) (tstamp ad02d335-dcea-49be-b0d4-1332487f167f))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-64_Die462.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)