(footprint "ST_WLCSP-66_Die432" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf")
  (tags "BGA 66 0.4")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp dd5eeea0-1d22-4685-8667-cea76d856baa)
  )
  (fp_text value "ST_WLCSP-66_Die432" (at 0 3.1145) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 199fa32b-bc5b-45b5-9593-97e40e4864f1)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.88 0.88) (thickness 0.132)))
    (tstamp 926a3979-b1b0-4f5d-981a-05a5d26bf0f1)
  )
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  (pad "J4" smd circle (at -0.2 1.6) (size 0.24 0.24) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 91b3cc03-67cf-4bc8-9c1a-1f2ac58af91f))
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  (pad "J6" smd circle (at 0.6 1.6) (size 0.24 0.24) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 788edca4-307c-489f-9aec-9efdacc7e412))
  (pad "J7" smd circle (at 1 1.6) (size 0.24 0.24) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0259cfa0-58bc-40d0-b817-606b604fffd1))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-66_Die432.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)