(footprint "ST_WLCSP-81_Die463" (version 20211014) (generator pcbnew) (layer "F.Cu") (tedit 5AE11EAD) (descr "WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00282249.pdf") (tags "BGA 81 0.4") (attr smd) (fp_text reference "REF**" (at 0 -2.9755) (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))) (tstamp f66aeaee-9e7f-4f3f-b518-7fadd8d51faa) ) (fp_text value "ST_WLCSP-81_Die463" (at 0 2.9755) (layer "F.Fab") (effects (font (size 1 1) (thickness 0.15))) (tstamp b3751428-f3f6-433f-8278-eb04fb2d0c42) ) (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab") (effects (font (size 0.94 0.94) (thickness 0.141))) (tstamp ba02e5c7-5802-49e8-8f06-380d2549b7df) ) (fp_line (start 2.1445 2.1005) (end -2.1445 2.1005) (layer "F.SilkS") (width 0.12) (tstamp 21c3267e-4a8f-4c08-9db3-60e90f026152)) (fp_line (start -1.15675 -2.1005) (end 2.1445 -2.1005) (layer "F.SilkS") (width 0.12) (tstamp a244d2b0-f3bd-41f5-8efc-614345fbec30)) (fp_line (start -2.1445 2.1005) (end -2.1445 -1.11275) (layer "F.SilkS") (width 0.12) (tstamp c8d467ca-6e6d-42af-a82c-e2d9598b3ef1)) (fp_line (start 2.1445 -2.1005) (end 2.1445 2.1005) (layer "F.SilkS") (width 0.12) (tstamp d66ad87b-2fd6-4717-962c-aaaadb8d4052)) (fp_line (start 3.02 2.98) (end 3.02 -2.98) (layer "F.CrtYd") (width 0.05) (tstamp 51207876-442f-4683-80b9-3be6aebd3118)) (fp_line (start -3.02 -2.98) (end -3.02 2.98) (layer "F.CrtYd") (width 0.05) (tstamp fc9add2f-0fce-4799-8724-75f596c48039)) (fp_line (start -3.02 2.98) (end 3.02 2.98) (layer "F.CrtYd") (width 0.05) (tstamp ff26e8a5-7fe9-4835-ad6e-e1acfea6a133)) (fp_line (start 3.02 -2.98) (end -3.02 -2.98) (layer "F.CrtYd") (width 0.05) (tstamp ffdbd27c-ffb0-41f9-9a39-cea1e213b89d)) (fp_line (start -2.0195 -0.98775) (end -1.03175 -1.9755) (layer "F.Fab") (width 0.1) (tstamp 5c7b7217-6f63-4e48-a026-527ed66f072f)) (fp_line (start 2.0195 1.9755) (end -2.0195 1.9755) (layer "F.Fab") (width 0.1) (tstamp 6b0411ec-fada-4bcf-b0b0-49f7b9a9d721)) (fp_line (start -2.0195 1.9755) (end -2.0195 -0.98775) (layer "F.Fab") (width 0.1) (tstamp a03c0b2d-33ee-496a-9b3f-8958be8f7a80)) (fp_line (start -1.03175 -1.9755) (end 2.0195 -1.9755) (layer "F.Fab") (width 0.1) (tstamp c2727874-8734-497a-8872-9de7c49ba043)) (fp_line (start 2.0195 -1.9755) (end 2.0195 1.9755) (layer "F.Fab") (width 0.1) (tstamp c38870e5-2311-4f85-9210-311e61444b3a)) (pad "A1" smd circle (at -1.6 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp c80924dd-8368-4ab6-9524-223162a78ef9)) (pad "A2" smd circle (at -1.2 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 8d9d74a2-1474-4176-a668-9e1600cbf733)) (pad "A3" smd circle (at -0.8 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp a3548488-180f-489a-97bb-8b6b45cb24af)) (pad "A4" smd circle (at -0.4 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 3b8e97a2-097c-4adb-be29-11f7c80a0655)) (pad "A5" smd circle (at 0 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp a6c04898-5711-4325-a812-d385e7bb0dc3)) (pad "A6" smd circle (at 0.4 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 6769103a-9e4c-4e62-89b9-1e09568bac99)) (pad "A7" smd circle (at 0.8 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 5bab4955-aca2-443b-977c-cdd079ace5f4)) (pad "A8" smd circle (at 1.2 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 8cf045cb-1907-4f6b-a396-c05e688866a9)) (pad "A9" smd circle (at 1.6 -1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 85553436-8093-4d39-8ac7-e7b90fc2a4a6)) (pad "B1" smd circle (at -1.6 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 74a63c08-96e9-4e68-b6df-34a228654605)) (pad "B2" smd circle (at -1.2 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 84cf9969-57ad-4b19-ba74-8f47fd0693bc)) (pad "B3" smd circle (at -0.8 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 001a040d-3ba1-4ad8-8883-8fcc26fa5a62)) (pad "B4" smd circle (at -0.4 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 43c30f57-a865-4132-8d25-ea8cdf9e7d37)) (pad "B5" smd circle (at 0 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp cb820f17-255f-4d69-ad86-17d92712301f)) (pad "B6" smd circle (at 0.4 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 8df153e1-6371-4480-b50c-fce6ff17ad96)) (pad "B7" smd circle (at 0.8 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 6aa1b7b1-0863-49b3-b210-c82bed8288a4)) (pad "B8" smd circle (at 1.2 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp b493b2df-91e0-478b-845f-53223100c290)) (pad "B9" smd circle (at 1.6 -1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 3100016c-18d0-49f8-95e5-44c945e85f62)) (pad "C1" smd circle (at -1.6 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp edfb6bc3-a786-4844-8fe0-753c3995d873)) (pad "C2" smd circle (at -1.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 5ed09641-32dd-4616-9059-e0ef57d68154)) (pad "C3" smd circle (at -0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 37c40e95-ccc7-47cb-b79b-73148cfb5824)) (pad "C4" smd circle (at -0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 9b480848-9e7a-43ad-86cc-0060d54a1c34)) (pad "C5" smd circle (at 0 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 72911203-7251-4f06-b304-9c9d681b3312)) (pad "C6" smd circle (at 0.4 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 642a2e13-ced6-44a4-be4c-2f2fe05cf747)) (pad "C7" smd circle (at 0.8 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 83640094-91e9-4984-8408-f0f394a3bc02)) (pad "C8" smd circle (at 1.2 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 4d1a62e0-b42f-41c9-b326-d2b2a965278a)) (pad "C9" smd circle (at 1.6 -0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 7c4b0e66-6c49-49b6-9a78-c9f7574a0759)) (pad "D1" smd circle (at -1.6 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp efd4014b-02da-4f48-a8c0-fe5d3972eeac)) (pad "D2" smd circle (at -1.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp da468045-12a2-40fd-a3de-f4fcba68e065)) (pad "D3" smd circle (at -0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 4003f756-68b5-4769-961a-27330ab22eb5)) (pad "D4" smd circle (at -0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 1354003e-09f8-4cb9-b21d-fcb9160468ae)) (pad "D5" smd circle (at 0 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 8c978ec2-8a80-4b45-98b3-e35267dcbf0b)) (pad "D6" smd circle (at 0.4 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp cabce838-b7d2-487f-b51a-9c12c6943e67)) (pad "D7" smd circle (at 0.8 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 4dc5889e-221b-4458-ba73-cd1b6b513de4)) (pad "D8" smd circle (at 1.2 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 87fc1331-5081-4ddd-856c-c065f88dd77f)) (pad "D9" smd circle (at 1.6 -0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 99953826-d06c-4fad-ad43-11fdf2773f83)) (pad "E1" smd circle (at -1.6 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp c2b99a76-46ec-4936-9900-5b252d4166e2)) (pad "E2" smd circle (at -1.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 6c444f5a-f8b1-451e-b491-9842b7c548ff)) (pad "E3" smd circle (at -0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 013c3937-e79d-4918-8598-69d2bc502c38)) (pad "E4" smd circle (at -0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 50313b55-785f-4c40-a026-35b1f20dfcd5)) (pad "E5" smd circle (at 0 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 821b3a3a-d0bb-44ed-a91c-9051ff9e0874)) (pad "E6" smd circle (at 0.4 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 2fdca24f-ff81-4481-b44e-3f1a7fc40a04)) (pad "E7" smd circle (at 0.8 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp f095df66-82e6-4329-a575-02b8bcab35a6)) (pad "E8" smd circle (at 1.2 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 6042727d-9b71-4893-a377-4316b33d255b)) (pad "E9" smd circle (at 1.6 0) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp e59e6b72-bac2-48f6-819e-3e010613b312)) (pad "F1" smd circle (at -1.6 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 49148d0a-aeb8-4472-9e9d-ed54fc409c4c)) (pad "F2" smd circle (at -1.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 67378277-70a8-4c90-87c0-eae9c6367046)) (pad "F3" smd circle (at -0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 654fe592-c16a-497e-b747-dac7cc5e080a)) (pad "F4" smd circle (at -0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp bfeeac83-8221-47e0-8b3f-197194f1b3da)) (pad "F5" smd circle (at 0 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 5e61feb0-7d9f-482f-bb06-b5988b11665e)) (pad "F6" smd circle (at 0.4 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 18a61574-a24f-4680-8743-9446f3a82a2e)) (pad "F7" smd circle (at 0.8 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 5482bfb0-4c6e-43ac-88d8-b42e6f5610a3)) (pad "F8" smd circle (at 1.2 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 934a17f9-6df5-49d8-acbe-0a6d726cfe62)) (pad "F9" smd circle (at 1.6 0.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp ca8b056a-cd23-415a-9b7f-addd19c391af)) (pad "G1" smd circle (at -1.6 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 58658677-4885-4b48-8c02-36e6977488a1)) (pad "G2" smd circle (at -1.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp ad8553f3-0a97-43dc-acf9-5192c799f645)) (pad "G3" smd circle (at -0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp f6bf4ce8-ef7a-4adb-a8d6-1b3d5759cf42)) (pad "G4" smd circle (at -0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp bb84d22f-8e24-4e68-8e9a-9cfb6888a4ca)) (pad "G5" smd circle (at 0 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 0e66d062-05a2-489d-ad7a-820216f6a734)) (pad "G6" smd circle (at 0.4 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 14c1dcb8-f199-4390-9b3e-af888e4e9555)) (pad "G7" smd circle (at 0.8 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp a44d5428-6a0c-47a7-9d6e-caeda322b9ef)) (pad "G8" smd circle (at 1.2 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 497e8329-fd62-4154-b479-31d9b76c1bf8)) (pad "G9" smd circle (at 1.6 0.8) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 5d348481-8fc1-4b32-a6f9-8a7c8a2ec4b7)) (pad "H1" smd circle (at -1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 219ae5ef-ded2-403b-8cd8-950197bf6762)) (pad "H2" smd circle (at -1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 924129da-1f0c-4795-b52b-f9bc3455446f)) (pad "H3" smd circle (at -0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 80d3fd9a-c524-47c6-9382-9b0633d4e49c)) (pad "H4" smd circle (at -0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 5ea16738-1224-469a-a5a2-42ecb13f28b0)) (pad "H5" smd circle (at 0 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp cabd34f6-7999-48a6-8c57-06a149bdc46a)) (pad "H6" smd circle (at 0.4 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp e41502f8-08b7-47b3-9e80-3db4d3077a58)) (pad "H7" smd circle (at 0.8 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 0a8258a0-e1fe-43f4-9893-586baed0af58)) (pad "H8" smd circle (at 1.2 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 8b945bad-4df4-4b54-abb6-37d7c3c2f523)) (pad "H9" smd circle (at 1.6 1.2) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 6694f641-8ec2-43fb-a982-b2e1d6d20c73)) (pad "J1" smd circle (at -1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 9ecc00dd-cfc2-48c2-b1e1-13c4afa8c0fe)) (pad "J2" smd circle (at -1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 4432d9af-fa7d-42ca-8ff9-f2f6edcdec09)) (pad "J3" smd circle (at -0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp f2177e4d-365e-4a4a-9bd3-624497189314)) (pad "J4" smd circle (at -0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 0a0426fa-aa58-43eb-b885-5d8c73f2ad0c)) (pad "J5" smd circle (at 0 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 1daefb1e-4dc5-4f0c-adfa-73cbc462fd11)) (pad "J6" smd circle (at 0.4 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp fe82f6bd-4dc1-402a-87e6-3a8de62516b7)) (pad "J7" smd circle (at 0.8 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 7a02f8a9-1668-4a20-ad2d-b2e130df836d)) (pad "J8" smd circle (at 1.2 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 38d0a9ef-a697-4c7e-93ed-48e4d1200d26)) (pad "J9" smd circle (at 1.6 1.6) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask") (solder_paste_margin_ratio 0.055556) (tstamp 50c880ca-432d-4bf7-b241-6e648809a699)) (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-81_Die463.wrl" (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)) ) )