(footprint "WLCSP-36_2.82x2.67mm_Layout6x6_P0.4mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A4F6887)
  (descr "WLCSP-36, https://www.nxp.com/docs/en/package-information/98ASA00949D.pdf")
  (tags "WLCSP-36")
  (attr smd)
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    (tstamp 01ac7224-ea1d-4be7-b5ed-882f836e52aa)
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  (pad "F2" smd circle (at -0.6 1) (size 0.26 0.26) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7852c99d-8e8b-425a-959e-65c1917c44c8))
  (pad "F3" smd circle (at -0.2 1) (size 0.26 0.26) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a5ff177f-8650-4c09-8677-1ed5f37c8f66))
  (pad "F4" smd circle (at 0.2 1) (size 0.26 0.26) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e3a4e610-6fff-4ab6-94d4-759905d67fdc))
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  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/WLCSP-36_2.82x2.67mm_Layout6x6_P0.4mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)