(footprint "WLCSP-8_1.58x1.63x0.35mm_Layout3x5_P0.35x0.4mm_Ball0.25mm_Pad0.25mm_NSMD" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5B9FB40A)
  (descr "WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf")
  (tags "WLCSP WLCSP-8 XFBGA XFBGA-8  CSP BGA Chip-Scale Glass-Top")
  (attr smd)
  (fp_text reference "REF**" (at 0 -1.85) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9fe6d171-4b77-4123-a1f5-5c2c0796a8f5)
  )
  (fp_text value "WLCSP-8_1.58x1.63x0.35mm_Layout3x5_P0.35x0.4mm_Ball0.25mm_Pad0.25mm_NSMD" (at 0 2.76) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b8af9121-1010-4f71-9d92-a242dd60295b)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.4 0.4) (thickness 0.06)))
    (tstamp 521122ac-9db1-458b-9b59-d8257b6d57db)
  )
  (fp_line (start -0.5 -1.025) (end -1 -1.025) (layer "F.SilkS") (width 0.1) (tstamp 1b14f28f-668e-4bad-9d8c-96a3cff02cd4))
  (fp_line (start 0.9 0.925) (end 0.9 -0.925) (layer "F.SilkS") (width 0.1) (tstamp 41497ba6-b29e-4124-bef5-93d1b15dcbcb))
  (fp_line (start 0.9 -0.925) (end -0.9 -0.925) (layer "F.SilkS") (width 0.1) (tstamp 4ef55f5a-1eaf-482f-a982-7705464d1231))
  (fp_line (start -0.9 0.925) (end 0.9 0.925) (layer "F.SilkS") (width 0.1) (tstamp 63a3f036-2f4e-49e1-b694-a010c55ceeba))
  (fp_line (start -0.9 0.925) (end -0.9 -0.925) (layer "F.SilkS") (width 0.1) (tstamp 708b2fe3-127a-4267-897e-afbeda30e943))
  (fp_line (start -1 -0.525) (end -0.9 -0.525) (layer "F.SilkS") (width 0.1) (tstamp 9809704e-5a0b-45d5-b719-079ecebfab1f))
  (fp_line (start -1 -0.525) (end -1 -1.025) (layer "F.SilkS") (width 0.1) (tstamp a0c87d12-fca8-4fca-ace3-d6ca29be439f))
  (fp_line (start -0.95 -0.975) (end -0.9 -0.925) (layer "F.SilkS") (width 0.1) (tstamp d3c0439f-bea6-4de1-8ba7-e28a37a56ee2))
  (fp_line (start -0.5 -1.025) (end -0.5 -0.925) (layer "F.SilkS") (width 0.1) (tstamp f71e1ccf-37ce-4374-86d9-079718b57ee8))
  (fp_line (start 1.8 -1.83) (end -1.8 -1.83) (layer "F.CrtYd") (width 0.05) (tstamp 447a06d0-14cb-4b3a-ba2d-6a1fce872250))
  (fp_line (start -1.8 1.8) (end -1.8 -1.83) (layer "F.CrtYd") (width 0.05) (tstamp 5e367834-7eee-446c-87e2-bdba4ce01e37))
  (fp_line (start -1.8 1.83) (end 1.8 1.83) (layer "F.CrtYd") (width 0.05) (tstamp ad4d7366-3127-4b8f-84ed-3ee5707355da))
  (fp_line (start 1.8 1.83) (end 1.8 -1.83) (layer "F.CrtYd") (width 0.05) (tstamp dc1e1de3-c467-4639-8e6a-28a258b6321c))
  (fp_line (start 0.7875 -0.8155) (end -0.50908 -0.8155) (layer "F.Fab") (width 0.1) (tstamp 177f202e-73d1-4210-b21d-1fc0341143e9))
  (fp_line (start -0.7875 0.8155) (end 0.7875 0.8155) (layer "F.Fab") (width 0.1) (tstamp 7f2fc44a-4628-4189-b452-a8ee035a9210))
  (fp_line (start 0.7875 -0.8155) (end 0.7875 0.8155) (layer "F.Fab") (width 0.1) (tstamp c829b550-d36d-459f-8366-607c43769b9e))
  (fp_line (start -0.7875 -0.53708) (end -0.7875 0.8155) (layer "F.Fab") (width 0.1) (tstamp c992bafb-2330-49c4-bc55-e24ef3c028ec))
  (fp_line (start -0.7875 -0.53708) (end -0.50908 -0.8155) (layer "F.Fab") (width 0.1) (tstamp f9eddb1d-0229-46cd-baa5-d6a956f8c7a6))
  (pad "A1" smd circle (at -0.35 -0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp 40710070-9639-4200-ad07-c8346a1bc939))
  (pad "A3" smd circle (at 0.35 -0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp e21c433e-6fa9-4f1a-9f65-52139e1d01df))
  (pad "B2" smd circle (at 0 -0.2) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp a632f57d-8aa1-4c8e-b9a6-4277c1036a57))
  (pad "C1" smd circle (at -0.35 0) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp c0397942-3338-4bc1-8a45-1b72a4324a5b))
  (pad "C3" smd circle (at 0.35 0) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp 8b2311ee-abf4-4746-892b-1a9028dd9c25))
  (pad "D2" smd circle (at 0 0.2) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp d813aceb-9735-4e31-8573-903b80b09c7b))
  (pad "E1" smd circle (at -0.35 0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp 1f89a6a3-21dd-4521-8f8a-3c418227757e))
  (pad "E3" smd circle (at 0.35 0.4) (size 0.25 0.25) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.03) (tstamp 8cf69ef5-088a-438a-ad71-7a1ca040eb55))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/WLCSP-8_1.58x1.63x0.35mm_Layout3x5_P0.35x0.4mm_Ball0.25mm_Pad0.25mm_NSMD.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)