(footprint "DFN-S-8-1EP_6x5mm_P1.27mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5EA4C14B)
  (descr "8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "DFN 1.27")
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.575) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 2ace1923-fd68-4f1f-9840-edcfc4d55c76)
  )
  (fp_text value "DFN-S-8-1EP_6x5mm_P1.27mm" (at 0 3.575) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 0171317d-dea6-4e88-bd83-1de5804bb399)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 7f0892cc-b6b3-486b-a7d0-fd10a28a8de9)
  )
  (fp_line (start -1.2 -2.65) (end 3 -2.65) (layer "F.SilkS") (width 0.15) (tstamp 053771bb-1936-4d23-a790-387d95faab48))
  (fp_line (start -3 2.65) (end 3 2.65) (layer "F.SilkS") (width 0.15) (tstamp ba2b3b77-b9d8-43c1-9b23-04d51923faf5))
  (fp_line (start -3.6 -2.85) (end -3.6 2.85) (layer "F.CrtYd") (width 0.05) (tstamp 0352aeb7-9e21-4cb8-964e-a32794c89c1f))
  (fp_line (start 3.6 -2.85) (end 3.6 2.85) (layer "F.CrtYd") (width 0.05) (tstamp 04370837-4f49-436f-914a-0812ff33ff0e))
  (fp_line (start -3.6 2.85) (end 3.6 2.85) (layer "F.CrtYd") (width 0.05) (tstamp 164f2480-d787-4205-9749-769897555091))
  (fp_line (start -3.6 -2.85) (end 3.6 -2.85) (layer "F.CrtYd") (width 0.05) (tstamp 84c435ed-665e-4272-984b-144923db371d))
  (fp_line (start -2 -2.5) (end 3 -2.5) (layer "F.Fab") (width 0.15) (tstamp 0f9a7645-e733-4085-9c17-d92890f23cf1))
  (fp_line (start 3 2.5) (end -3 2.5) (layer "F.Fab") (width 0.15) (tstamp 59ef35ac-8649-480d-a2df-5e61371003e4))
  (fp_line (start 3 -2.5) (end 3 2.5) (layer "F.Fab") (width 0.15) (tstamp 6904ed5c-9b8b-4c34-b375-7947bebbcf02))
  (fp_line (start -3 -1.5) (end -2 -2.5) (layer "F.Fab") (width 0.15) (tstamp 7fd574c2-5cbd-40da-a060-ce40ef498f40))
  (fp_line (start -3 2.5) (end -3 -1.5) (layer "F.Fab") (width 0.15) (tstamp b5986aef-25f9-4216-8409-bc45cd9d2a77))
  (pad "1" smd oval (at -2.8 -1.905) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d0169bb6-b836-42ee-9542-85333ec7af69))
  (pad "2" smd oval (at -2.8 -0.635) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 19d485a1-648d-474d-9232-2019d64cf23c))
  (pad "3" smd oval (at -2.8 0.635) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 294f22f9-b8be-4ca2-97d5-b0caf4ec8438))
  (pad "4" smd oval (at -2.8 1.905) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b90c4e4e-a0d4-4170-b2c0-5c82a9fdda3c))
  (pad "5" smd oval (at 2.8 1.905) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7bc9d696-4e85-4925-8829-723b21c10a3e))
  (pad "6" smd oval (at 2.8 0.635) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e5246318-603f-4d75-bc15-291fd07c4bb0))
  (pad "7" smd oval (at 2.8 -0.635) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5c0c6e01-fbea-4db7-baeb-ad50cdd46500))
  (pad "8" smd oval (at 2.8 -1.905) (size 1.1 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp efdd15c9-483e-4eca-ab3d-6afbd5d5d48f))
  (pad "9" smd rect (at 0.6 1.5375) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 02b1ab75-de40-4843-b3c2-47135501f662))
  (pad "9" smd rect (at -0.6 0.512499) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 03a08781-01d4-491f-9034-f076318c7e0c))
  (pad "9" smd rect (at -0.6 1.5375) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 7a08be3b-a90e-423d-8895-c08509a8f1d7))
  (pad "9" smd rect (at -0.6 -0.5125) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 83d0c972-f75c-457c-b32f-af8a258133dc))
  (pad "9" smd rect (at 0.6 -0.5125) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp a78e50aa-4323-44eb-96db-ed270773cdf9))
  (pad "9" smd rect (at 0.6 0.512499) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp b628e301-9494-4560-9cbe-484ea03c87fe))
  (pad "9" smd rect (at -0.6 -1.5375) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp c5ad70b1-7dab-4893-8976-f9fc9dfcbb91))
  (pad "9" smd rect (at 0.6 -1.5375) (size 1.2 1.025) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp e64599ff-55b2-41c2-a28c-aeb6edd88a03))
  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/DFN-S-8-1EP_6x5mm_P1.27mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)