(footprint "Microchip_8E-16" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A0AA2C0)
  (descr "16-Lead Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN Microchip 8E 16")
  (solder_mask_margin 0.1)
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.1) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp a9fc2f0c-de44-454d-9de8-3b22bd6cf7ef)
  )
  (fp_text value "Microchip_8E-16" (at 0 3.1) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 0a3a330d-94c1-4bef-af22-52890ff0651c)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.8 0.8) (thickness 0.15)))
    (tstamp 3457c8af-54a2-40de-b646-d63c395553e4)
  )
  (fp_line (start -2.175 2.175) (end -2.175 1.375) (layer "F.SilkS") (width 0.15) (tstamp 3c1404d1-2687-4b47-b341-b2abb17872bb))
  (fp_line (start 2.175 -2.175) (end 2.175 -1.375) (layer "F.SilkS") (width 0.15) (tstamp cc5dfc44-a1b7-49da-94df-b0dd5a4986a4))
  (fp_line (start -2.175 -2.175) (end -1.375 -2.175) (layer "F.SilkS") (width 0.15) (tstamp d51c8147-2eca-4218-9208-fb05e471ef63))
  (fp_line (start -2.175 2.175) (end -1.375 2.175) (layer "F.SilkS") (width 0.15) (tstamp e880dee5-cd14-435c-8768-5dce08028964))
  (fp_line (start 2.175 2.175) (end 1.375 2.175) (layer "F.SilkS") (width 0.15) (tstamp e8931c64-e563-4e5b-9ce8-919c59bc348b))
  (fp_line (start 2.175 -2.175) (end 1.375 -2.175) (layer "F.SilkS") (width 0.15) (tstamp ed7bf669-98d1-436f-8cad-efe33e1b0041))
  (fp_line (start 2.175 2.175) (end 2.175 1.375) (layer "F.SilkS") (width 0.15) (tstamp eec89892-c5e1-47a6-811b-e82aff263161))
  (fp_line (start 2.5 -2.5) (end 2.5 2.5) (layer "F.CrtYd") (width 0.05) (tstamp 350a2a96-ce1c-483b-bcbf-a6bb0322b561))
  (fp_line (start -2.5 -2.5) (end 2.5 -2.5) (layer "F.CrtYd") (width 0.05) (tstamp 7ec00b4a-fdd1-48d9-80d0-247b2dfe2e4c))
  (fp_line (start -2.5 -2.5) (end -2.5 2.5) (layer "F.CrtYd") (width 0.05) (tstamp a57d4cc3-8df8-4d12-a017-edcadacd18e3))
  (fp_line (start -2.5 2.5) (end 2.5 2.5) (layer "F.CrtYd") (width 0.05) (tstamp b62402d4-2f86-4fb9-a277-9b56a7083685))
  (fp_line (start 2 -2) (end 2 2) (layer "F.Fab") (width 0.1) (tstamp 094390bb-5a10-4282-af38-f788bf2ef0d0))
  (fp_line (start 2 2) (end -2 2) (layer "F.Fab") (width 0.1) (tstamp 7d8e7a19-d79b-41fe-8d2c-212b6a151e76))
  (fp_line (start -2 2) (end -2 -1) (layer "F.Fab") (width 0.1) (tstamp 888a8354-6304-44e9-bd6d-695e67193e4a))
  (fp_line (start -1 -2) (end -2 -1) (layer "F.Fab") (width 0.1) (tstamp 96ad3a01-45bc-4898-ab96-0fb09ecc0644))
  (fp_line (start -1 -2) (end 2 -2) (layer "F.Fab") (width 0.1) (tstamp a412468c-bb3b-48ec-bf42-2d61d21655e4))
  (pad "1" smd rect (at -1.8125 -0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d8c90caa-74f2-418e-8216-418d21b97a0c))
  (pad "2" smd rect (at -1.8125 -0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e07d9178-08ad-45b1-b834-406a7ee973d4))
  (pad "3" smd rect (at -1.8125 0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c215a064-3f42-45cc-9a69-f78b821e1cda))
  (pad "4" smd rect (at -1.8125 0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2c56d5c2-aca7-4fd6-b2cc-272139641dc5))
  (pad "5" smd rect (at -0.975 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ac465140-87d3-42c6-9782-113da4099189))
  (pad "6" smd rect (at -0.325 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6e67919c-cc47-49a5-8383-402890559347))
  (pad "7" smd rect (at 0.325 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b2bfb99f-370e-4bfe-9162-b0fc43a1c3b8))
  (pad "8" smd rect (at 0.975 1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c1590392-41f9-4ed9-96cc-1e05170f00bc))
  (pad "9" smd rect (at 1.8125 0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fbde2239-7eab-4ce2-b95c-d67d840104cf))
  (pad "10" smd rect (at 1.8125 0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp adfe7ca5-9a80-42da-bc1e-eeb2051a9417))
  (pad "11" smd rect (at 1.8125 -0.325) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c3df8878-5a9a-4507-a512-a7630136e9ee))
  (pad "12" smd rect (at 1.8125 -0.975) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 854a4e76-ae88-4be2-9811-b1b74e41b6e4))
  (pad "13" smd rect (at 0.975 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a29061a1-d2ae-4e18-a089-c225d98a5d05))
  (pad "14" smd rect (at 0.325 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 978bf96f-08ae-4a46-85c2-1d7b8effb0bf))
  (pad "15" smd rect (at -0.325 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7909aef7-294f-4694-a042-88fd5934cfff))
  (pad "16" smd rect (at -0.975 -1.8125 90) (size 0.725 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36a5b41a-76c6-48b0-9d92-8c7a969065f0))
  (pad "17" smd rect (at 0.5375 0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 3922dda6-6efa-4652-bc9d-57feef60f59e))
  (pad "17" smd rect (at -0.5375 -0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 3bfde717-089e-4828-83be-96b6f1ffa236))
  (pad "17" smd rect (at 0.5375 -0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 3e563b46-0bca-4bd9-ae40-18cf98ef354f))
  (pad "17" smd rect (at -0.5375 0.5375) (size 1.075 1.075) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 520afa04-e89c-47ee-b746-52bf2d52f3b6))
  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-16-1EP_4x4mm_Pitch0.65mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)