(footprint "QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5DC5F6A3)
  (descr "QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278), generated with kicad-footprint-generator ipc_noLead_generator.py")
  (tags "QFN NoLead")
  (attr smd)
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    (tstamp 46a2eb31-eec9-46c9-9569-6076c858a178)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 3ece41ce-c2d2-4d76-946f-eab590ba4bac)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 8413c9d1-7050-4050-8839-842ab861c5b6)
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  (pad "25" thru_hole circle (at 1.05 -1.05) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp 5eedf7fd-0162-4094-9c3f-9ff5a050e1bc))
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  (pad "25" thru_hole circle (at 1.05 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp 8debd5dd-a84d-454b-8dd3-89015dbce526))
  (pad "25" smd rect (at 0 0) (size 2.6 2.6) (layers "B.Cu") (tstamp 9385278c-8b30-43c8-a1fa-21b9777f3fa4))
  (pad "25" thru_hole circle (at -1.05 1.05) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp c2167e44-7bea-4b85-9e36-faad04eb7500))
  (pad "25" thru_hole circle (at -1.05 0) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp d30d9e18-f4ef-46e2-8679-ea182f63ebdc))
  (pad "25" thru_hole circle (at -1.05 -1.05) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp e1c808eb-d061-47cd-a9f8-dc3532d3010f))
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  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)