(footprint "UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5DC5F6A7)
  (descr "UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332), generated with kicad-footprint-generator ipc_noLead_generator.py")
  (tags "UQFN NoLead")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 7362010f-1949-42d2-ae39-03bffdfed634)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 67671cf0-2ed0-4373-a03e-b45680084c4b)
  )
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    (effects (font (size 0.75 0.75) (thickness 0.11)))
    (tstamp 17f36124-c83d-4ba2-8054-e2b76397ce88)
  )
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  (fp_line (start -0.75 -1.5) (end 1.5 -1.5) (layer "F.Fab") (width 0.1) (tstamp b8cb35fb-8f6d-4686-985c-e3a3c7b53c32))
  (pad "" smd roundrect (at -0.46 0.46) (size 0.8 0.8) (layers "F.Paste") (roundrect_rratio 0.25) (tstamp 243cf489-5566-45c5-b0df-5f24e2e4cb6b))
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  (pad "2" smd roundrect (at -1.4875 -0.4) (size 0.725 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 58495a06-5832-4161-92de-58a3b618def3))
  (pad "3" smd roundrect (at -1.4875 0) (size 0.725 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp f769c549-5ebb-4008-bbb6-242aa30b9c1e))
  (pad "4" smd roundrect (at -1.4875 0.4) (size 0.725 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 545683e9-13ae-4b05-8eaa-846e89f41d5c))
  (pad "5" smd roundrect (at -1.4875 0.8) (size 0.725 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp b79f90b9-15da-4613-8117-0187229fec51))
  (pad "6" smd roundrect (at -0.8 1.4875) (size 0.2 0.725) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 7d05430e-c544-49f1-a80b-bd0412f70b6b))
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  (pad "10" smd roundrect (at 0.8 1.4875) (size 0.2 0.725) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 7acf9189-6ac9-423a-a999-3bce2fbec2ff))
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  (pad "14" smd roundrect (at 1.4875 -0.4) (size 0.725 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a6aedadf-4446-4cca-b021-9d30954835e6))
  (pad "15" smd roundrect (at 1.4875 -0.8) (size 0.725 0.2) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 19a6ed0e-035c-4b28-9eb8-64bae654053f))
  (pad "16" smd roundrect (at 0.8 -1.4875) (size 0.2 0.725) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp eedd2278-eebc-43f1-87ec-8408458bd369))
  (pad "17" smd roundrect (at 0.4 -1.4875) (size 0.2 0.725) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 813c4b72-c03b-438a-88b3-ce561e99f456))
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  (pad "20" smd roundrect (at -0.8 -1.4875) (size 0.2 0.725) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 2febbd01-d13e-47f7-96dd-c7bfb64250ad))
  (pad "21" smd rect (at 0 0) (size 1.85 1.85) (layers "B.Cu") (tstamp 0fecd51d-74c2-4dbe-8534-1ed714395873))
  (pad "21" thru_hole circle (at -0.675 0.675) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp 2ce39c1f-8b5e-4548-b6e1-3e0a06882a9f))
  (pad "21" thru_hole circle (at -0.675 -0.675) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp e8efe3ca-b612-4744-80ae-a96cd4652bb0))
  (pad "21" smd rect (at 0 0) (size 1.85 1.85) (layers "F.Cu" "F.Mask") (tstamp f7475b83-2f1a-4567-b101-8c7770028639))
  (pad "21" thru_hole circle (at 0.675 0.675) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp fbb8ced6-6a87-4e32-a2d1-6cc91cde3c23))
  (pad "21" thru_hole circle (at 0.675 -0.675) (size 0.5 0.5) (drill 0.2) (layers *.Cu) (tstamp ffdbec8b-f420-4a50-9196-535a90c561c1))
  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)