(footprint "DIP-28_W8.89mm_SMDSocket_LongPads" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02E8C5)
  (descr "28-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads")
  (tags "THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b92f1f09-06b1-471a-88e3-0d77bf86f72e)
  )
  (fp_text value "DIP-28_W8.89mm_SMDSocket_LongPads" (at 0 18.84) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 5c38911d-ce6b-41c8-aadf-e37ae8369dfe)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 83520d5a-b15a-400c-a63d-cf0a248e6f54)
  )
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  (pad "13" smd rect (at -4.445 13.97) (size 3.1 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ac72482a-6b16-40cd-9c6c-8818ae948293))
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  (pad "15" smd rect (at 4.445 16.51) (size 3.1 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 6768789d-f236-46d8-8121-dec1cdb81e46))
  (pad "16" smd rect (at 4.445 13.97) (size 3.1 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a2d5538a-0b83-4f43-b6b8-c10ea162ced4))
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  (model "${KICAD6_3DMODEL_DIR}/Package_DIP.3dshapes/DIP-28_W8.89mm_SMDSocket.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)