(footprint "DIP-64_W26.67mm_SMDSocket_LongPads" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02E8C5)
  (descr "64-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads")
  (tags "THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads")
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  )
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)