(footprint "Vishay_HVM-DIP-3_W7.62mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A700D5A)
  (descr "3-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf")
  (tags "THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP")
  (attr through_hole)
  (fp_text reference "REF**" (at 3.81 -2.33) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9f326f40-a3d7-4186-a0a1-4602ad0cd07c)
  )
  (fp_text value "Vishay_HVM-DIP-3_W7.62mm" (at 3.81 4.87) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b67f50a9-e0d1-4a19-8988-7617ea070e52)
  )
  (fp_text user "${REFERENCE}" (at 3.81 1.27) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 3f137e04-b811-43cd-b314-5240945002d2)
  )
  (fp_line (start 1.61 3.87) (end 1.61 -1.33) (layer "F.SilkS") (width 0.12) (tstamp 2baa13b7-0106-4879-b018-c501156aa2a4))
  (fp_line (start 6.46 3.87) (end 6.46 -1.33) (layer "F.SilkS") (width 0.12) (tstamp 3d37e362-d70c-405e-93ef-3b7fa50b1903))
  (fp_line (start 1.21 3.87) (end 1.21 -1.33) (layer "F.SilkS") (width 0.12) (tstamp 490cc789-2916-4686-81d4-1cf17d7d6d9b))
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  (pad "1" thru_hole rect (at 0 2.54) (size 1.8 2.8) (drill 0.9 (offset 0 -0.5)) (layers *.Cu *.Mask) (tstamp ad17968c-cf5f-469f-a635-bb766fd93bd9))
  (pad "1" thru_hole rect (at 0 0) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask) (tstamp ca144ae0-7e9e-4492-996c-aa81bffc3242))
  (pad "2" thru_hole oval (at 7.62 2.54) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask) (tstamp 0d4d9b0e-2717-4a0d-92de-2051f1bf927f))
  (pad "3" thru_hole oval (at 7.62 0) (size 1.8 1.8) (drill 0.9) (layers *.Cu *.Mask) (tstamp 7071db1d-5aa6-4fa6-a2e1-ef515f329465))
  (model "${KICAD6_3DMODEL_DIR}/Package_DIP.3dshapes/Vishay_HVM-DIP-3_W7.62mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)