(footprint "ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A670F76)
  (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference "REF**" (at 0 -4.3) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 2ec28d52-7205-4bac-87f9-79acf5b5c42e)
  )
  (fp_text value "ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm" (at 0 4.4) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 52355d7d-2298-4a5b-8952-d3715f44fc37)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.8 0.8) (thickness 0.15)))
    (tstamp d51b39f8-1392-4ed6-9dae-89745ad30290)
  )
  (fp_line (start -2.225 3.45) (end 2.225 3.45) (layer "F.SilkS") (width 0.15) (tstamp b2d15c8c-f324-4cf2-ba5f-0f4352800bb7))
  (fp_line (start -3.75 -3.45) (end 2.225 -3.45) (layer "F.SilkS") (width 0.15) (tstamp fcb66a70-b7e2-4af5-8bc7-7141e009962d))
  (fp_line (start 3.95 -3.55) (end 3.95 3.55) (layer "F.CrtYd") (width 0.05) (tstamp 0b48b62e-ab58-4439-ae7c-5d6c5df43aff))
  (fp_line (start -3.95 -3.55) (end 3.95 -3.55) (layer "F.CrtYd") (width 0.05) (tstamp 4c066b64-030f-4132-aa6c-3f5d17f38a67))
  (fp_line (start -3.95 3.55) (end 3.95 3.55) (layer "F.CrtYd") (width 0.05) (tstamp 55cd2c6d-8f9c-4120-b568-8d1742266c67))
  (fp_line (start -3.95 -3.55) (end -3.95 3.55) (layer "F.CrtYd") (width 0.05) (tstamp 948777f5-5366-4cbf-946b-41a93f0c9a0e))
  (fp_line (start 2.2 3.25) (end -2.2 3.25) (layer "F.Fab") (width 0.15) (tstamp 29e3ac03-fc3b-42b4-8388-0145d8b45b4d))
  (fp_line (start -2.2 -2.25) (end -1.2 -3.25) (layer "F.Fab") (width 0.15) (tstamp 2bb6b912-549e-4064-972b-ba1766b4513d))
  (fp_line (start -1.2 -3.25) (end 2.2 -3.25) (layer "F.Fab") (width 0.15) (tstamp 34f6d9eb-b3d7-43db-8c4f-57d672e9cedf))
  (fp_line (start 2.2 -3.25) (end 2.2 3.25) (layer "F.Fab") (width 0.15) (tstamp c0b3ac29-c210-4b7a-a797-8bd4b3b26747))
  (fp_line (start -2.2 3.25) (end -2.2 -2.25) (layer "F.Fab") (width 0.15) (tstamp e0a2a73b-15a7-4cfb-81fe-d752cc394dec))
  (pad "" smd rect (at -0.75 -1.4) (size 1.2 1.14) (layers "F.Paste") (tstamp 2f58dc5f-9167-4a80-9818-f5f15accb319))
  (pad "" smd rect (at 0.75 -1.4) (size 1.2 1.14) (layers "F.Paste") (tstamp 7e21ce51-84ac-49d9-9e32-a7488f507690))
  (pad "" smd rect (at 0.75 1.4) (size 1.2 1.14) (layers "F.Paste") (tstamp a3635d21-d83a-447d-a734-04287a69c818))
  (pad "" smd rect (at -0.75 0) (size 1.2 1.14) (layers "F.Paste") (tstamp d76fe63e-b58a-4786-b470-a487a4df7b74))
  (pad "" smd rect (at -0.75 1.4) (size 1.2 1.14) (layers "F.Paste") (tstamp f01d557d-1bfd-4365-9b00-16090f525447))
  (pad "" smd rect (at 0.75 0) (size 1.2 1.14) (layers "F.Paste") (tstamp ffa2a84d-9390-46f8-a4d1-a44a108f3d88))
  (pad "1" smd rect (at -2.95 -2.925) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2c3b649a-a36f-4e1d-9224-1d6dd6f8cc64))
  (pad "2" smd rect (at -2.95 -2.275) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f84ddb20-19ee-4a81-b141-9173312fa7d2))
  (pad "3" smd rect (at -2.95 -1.625) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 53088132-753a-463c-a4ff-c4ec824c6547))
  (pad "4" smd rect (at -2.95 -0.975) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4ba15524-ace1-4cde-8fce-458d30d0fd69))
  (pad "5" smd rect (at -2.95 -0.325) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a5da9229-25ea-4ccc-893a-fa0ec55c32cc))
  (pad "6" smd rect (at -2.95 0.325) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fdb66c91-6112-494e-8824-22e688b0df07))
  (pad "7" smd rect (at -2.95 0.975) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d9ef3da1-1a80-487a-b6d0-d55930730f13))
  (pad "8" smd rect (at -2.95 1.625) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 79999430-47ee-4717-923c-9f23be9e1ff2))
  (pad "9" smd rect (at -2.95 2.275) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4aa5821c-4e1a-4dcd-b1c9-a9dbb275cb89))
  (pad "10" smd rect (at -2.95 2.925) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 23e41a6b-02f9-4061-a827-9d2f9316776e))
  (pad "11" smd rect (at 2.95 2.925) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4cc4b1c9-17b2-4afd-be99-c3c4900f3a1a))
  (pad "12" smd rect (at 2.95 2.275) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 782be001-c424-4fb5-9ce5-2a4a2f9a026d))
  (pad "13" smd rect (at 2.95 1.625) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 101eeb36-db5a-4edb-bcc5-958297125970))
  (pad "14" smd rect (at 2.95 0.975) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp dfb26704-0fc7-4f90-8dcb-6c785000ca4a))
  (pad "15" smd rect (at 2.95 0.325) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 840a9c26-1d95-498a-82f0-43dabae868ce))
  (pad "16" smd rect (at 2.95 -0.325) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ec377537-a01a-4166-b26d-9513545bc951))
  (pad "17" smd rect (at 2.95 -0.975) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 13d032b3-130d-4c2b-bc2b-4e5528ceb64a))
  (pad "18" smd rect (at 2.95 -1.625) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d954c9af-35a3-4c2f-b6fb-960aba2fb5a0))
  (pad "19" smd rect (at 2.95 -2.275) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 46687cef-5c3a-4c57-b3dd-0719251319a3))
  (pad "20" smd rect (at 2.95 -2.925) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 37ae144b-3cf0-4e36-a760-84db237ce168))
  (pad "21" smd rect (at 0 0) (size 3 4.2) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp cc38bb1e-753d-4992-ba61-c9f5f84f16b9))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/ETSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3x4.2mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)