(footprint "HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02F2D3)
  (descr "HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf)")
  (tags "HSOP 11.0 x 15.9mm Pitch 1.27mm")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 4cc7a411-f485-48a8-8184-ef6fa8d320be)
  )
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    (tstamp 3e663c39-0996-46f2-aea0-3b75712187e8)
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  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/HSOP-20-1EP_11.0x15.9mm_P1.27mm_SlugDown.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)