(footprint "HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02F25C)
  (descr "HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)")
  (tags "HSOP 11.0 x 15.9mm Pitch 0.65mm")
  (attr smd)
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  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugDown.wrl"
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    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
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)