(footprint "HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A671CA1)
  (descr "HTSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf)")
  (tags "SSOP 0.65 PowerPAD")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp c33c1c66-340f-4fa3-949f-a505ba76ff15)
  )
  (fp_text value "HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm_Mask4.11x4.36mm" (at 0 6.55) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 875faf7c-2d91-40fe-aa33-5519ef804413)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.8 0.8) (thickness 0.15)))
    (tstamp db157926-fa20-434f-b586-50528b46ce33)
  )
  (fp_line (start 3.175 -5.625) (end 3.175 -5.3) (layer "F.SilkS") (width 0.15) (tstamp 238750cc-a7a4-4a88-a5f1-8afc84100e3d))
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  (fp_line (start -4.25 -5.4) (end -3.175 -5.4) (layer "F.SilkS") (width 0.15) (tstamp 51ffd93a-24a3-4cd9-abfb-98c5163d541f))
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  (fp_line (start -3.05 5.5) (end -3.05 -4.5) (layer "F.Fab") (width 0.15) (tstamp e6e9b93d-4100-4358-90b1-cacfe426299f))
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  (pad "8" smd rect (at -3.65 -0.325) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 49d91757-8843-4678-ae2a-930379412f28))
  (pad "9" smd rect (at -3.65 0.325) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 10fd7d4a-b3ca-4930-8402-e1319603b278))
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  (pad "11" smd rect (at -3.65 1.625) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a1d8668b-30e8-4a50-afd1-8c85da52e44d))
  (pad "12" smd rect (at -3.65 2.275) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0240c0b8-68b5-4daa-8fb6-e7688c41694c))
  (pad "13" smd rect (at -3.65 2.925) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ea371b41-541c-4484-b39b-44e9b416cbcf))
  (pad "14" smd rect (at -3.65 3.575) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp dabfd322-5824-4f3b-ad92-6082189ad81f))
  (pad "15" smd rect (at -3.65 4.225) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fd3b4af4-890e-4002-b43f-1ef92ef93e6a))
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  (pad "26" smd rect (at 3.65 -0.975) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e37c6e75-f7f0-435b-97b1-57ceb6b3ffaa))
  (pad "27" smd rect (at 3.65 -1.625) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 290b7ef7-ed6d-43d5-995b-43a344e8e08f))
  (pad "28" smd rect (at 3.65 -2.275) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d2086639-8347-4435-abec-01ad776e5a19))
  (pad "29" smd rect (at 3.65 -2.925) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 236ef455-581d-49aa-86af-d50ea119a9c2))
  (pad "30" smd rect (at 3.65 -3.575) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 5019f5b0-0650-4c37-8e78-a8de4e3b22db))
  (pad "31" smd rect (at 3.65 -4.225) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c01994a8-2199-4789-857e-536b3b1c20bb))
  (pad "32" smd rect (at 3.65 -4.875) (size 1.2 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c0e7e026-b66a-4f47-b971-e037f611d6f9))
  (pad "33" smd rect (at 0 0) (size 5.2 11) (layers "F.Cu") (tstamp 36a04093-558f-41bf-996b-f84dc4b7c6e6))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/HTSSOP-32-1EP_6.1x11mm_P0.65mm_EP5.2x11mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)