(footprint "TI_SO-PowerPAD-8_ThermalVias" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02F2D3)
  (descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf")
  (tags "HTSOP 1.27")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp c924561c-5e62-4154-93ed-2bd7fadf520c)
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  (pad "9" thru_hole circle (at 0.6 1.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp a74d6881-6429-44e6-a656-c91719f2ace6))
  (pad "9" smd rect (at 0 0) (size 2.95 4.5) (layers "F.Cu") (tstamp b23d09de-c5bd-4860-b894-2a99a595f2ad))
  (pad "9" smd rect (at 0 0) (size 2.95 4.5) (layers "B.Cu") (tstamp da8e3227-a937-4eba-af67-c7250c697189))
  (pad "9" smd rect (at 0 0) (size 2.6 3.1) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp dafcdc19-3ca3-44cd-a0f1-b0affbcdb922))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_Pitch1.27mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)