(footprint "TSOP-I-28_11.8x8mm_P0.55mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AC6A6FB)
  (descr "TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf)")
  (tags "TSOP I 28 pins")
  (attr smd)
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  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp d89192cd-3ff3-4b6f-9d56-c328f1e7d058)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp e4802c8f-d07f-482c-a835-46a8835cc8b7)
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  (pad "23" smd rect (at 6.27 -0.825) (size 1.87 0.38) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d2689cc7-d969-4793-84cd-44054d323232))
  (pad "24" smd rect (at 6.27 -1.375) (size 1.87 0.38) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3acfcb27-110d-41cd-b616-0d0fa0d44a39))
  (pad "25" smd rect (at 6.27 -1.925) (size 1.87 0.38) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 22f9b94a-cc4a-4dce-a1fd-980ffb93e884))
  (pad "26" smd rect (at 6.27 -2.475) (size 1.87 0.38) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7367ced7-ba4d-4fb6-80ac-2aa876b9cbe7))
  (pad "27" smd rect (at 6.27 -3.025) (size 1.87 0.38) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 9094a553-953f-4895-9f6a-654b33a551ca))
  (pad "28" smd rect (at 6.27 -3.575) (size 1.87 0.38) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 57f95704-cf58-4125-8e0d-09e9392bbca0))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSOP-I-28_11.8x8mm_P0.55mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)