(footprint "TSSOP-28-1EP_4.4x9.7mm_P0.65mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02F25C)
  (descr "TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference "REF**" (at 0 -5.9) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 2f63d754-c083-495d-a57d-aacf3018baf3)
  )
  (fp_text value "TSSOP-28-1EP_4.4x9.7mm_P0.65mm" (at 0 5.9) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp ec0e3b60-d9b5-4b0f-9ec0-ba4e05c457b4)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.8 0.8) (thickness 0.15)))
    (tstamp b8a8355d-eb0d-4fb0-abf1-a6ff81b87cb4)
  )
  (fp_line (start 2.325 4.975) (end 2.325 4.65) (layer "F.SilkS") (width 0.15) (tstamp 1b832f02-a53b-460a-91cf-08f728fd83af))
  (fp_line (start -2.325 -4.975) (end 2.325 -4.975) (layer "F.SilkS") (width 0.15) (tstamp 2136d948-4519-46e8-8c53-80aa83cbe116))
  (fp_line (start -2.325 -4.75) (end -3.4 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 402a1e4d-02f1-4ff0-b1d1-93d2e91e6295))
  (fp_line (start -2.325 -4.975) (end -2.325 -4.75) (layer "F.SilkS") (width 0.15) (tstamp 6a672ba4-1e0e-4c8e-b862-0630a17a48c6))
  (fp_line (start 2.325 -4.975) (end 2.325 -4.65) (layer "F.SilkS") (width 0.15) (tstamp 6bc094cd-eeec-4552-aed2-a54853d59bc0))
  (fp_line (start -2.325 4.975) (end -2.325 4.65) (layer "F.SilkS") (width 0.15) (tstamp 8230348e-0b13-4b01-a6cf-8fe39b9d8c92))
  (fp_line (start -2.325 4.975) (end 2.325 4.975) (layer "F.SilkS") (width 0.15) (tstamp c3d8a113-d313-4aff-a85b-5614b56d93d2))
  (fp_line (start -3.65 -5.15) (end -3.65 5.15) (layer "F.CrtYd") (width 0.05) (tstamp 0eb154a5-4422-4b5b-b9de-fe3b8463e6d3))
  (fp_line (start -3.65 5.15) (end 3.65 5.15) (layer "F.CrtYd") (width 0.05) (tstamp 41733395-b77f-4a36-9daf-51d35b6a623d))
  (fp_line (start 3.65 -5.15) (end 3.65 5.15) (layer "F.CrtYd") (width 0.05) (tstamp 65ad8238-b872-4dac-9ade-bf014b76bd66))
  (fp_line (start -3.65 -5.15) (end 3.65 -5.15) (layer "F.CrtYd") (width 0.05) (tstamp db9c34ed-d54e-443b-9342-7132737bc929))
  (fp_line (start -2.2 4.85) (end -2.2 -3.85) (layer "F.Fab") (width 0.15) (tstamp 1a64a5f4-ab8a-4a88-8879-e177704067c4))
  (fp_line (start 2.2 4.85) (end -2.2 4.85) (layer "F.Fab") (width 0.15) (tstamp 929425e3-263c-42e9-a963-812d48e9b131))
  (fp_line (start -1.2 -4.85) (end 2.2 -4.85) (layer "F.Fab") (width 0.15) (tstamp a7f5f017-878f-4fdf-b399-1bf1d28d8621))
  (fp_line (start 2.2 -4.85) (end 2.2 4.85) (layer "F.Fab") (width 0.15) (tstamp bc140972-6c1f-48a3-85f9-98f8194a449c))
  (fp_line (start -2.2 -3.85) (end -1.2 -4.85) (layer "F.Fab") (width 0.15) (tstamp caf6ba19-6ab2-401e-84c9-07d056c785ee))
  (pad "1" smd rect (at -2.85 -4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a3cf6ffd-a893-43d7-b0ea-c7016ce07be3))
  (pad "2" smd rect (at -2.85 -3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f7140408-52d8-42bf-9fa9-5eafc6ac0e6e))
  (pad "3" smd rect (at -2.85 -2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 2a233007-7a24-4ea1-afee-fb2bd604d60f))
  (pad "4" smd rect (at -2.85 -2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 606cfafc-8283-40da-88e1-b5b5b9fbd145))
  (pad "5" smd rect (at -2.85 -1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 46c69f8e-5a84-47ed-b8b0-2f73620fb2bb))
  (pad "6" smd rect (at -2.85 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp abdda84b-acd6-4df7-9d20-7ba2d74e876f))
  (pad "7" smd rect (at -2.85 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e7243502-6658-417e-b365-65fcf3fb8cbf))
  (pad "8" smd rect (at -2.85 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a2f899e1-32a1-408a-9bcd-f3539b1d4212))
  (pad "9" smd rect (at -2.85 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f37cd259-cd79-4176-b265-a7b1f703a1e8))
  (pad "10" smd rect (at -2.85 1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c19e6c40-0840-4ccd-8d9e-c9dccef3aee4))
  (pad "11" smd rect (at -2.85 2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 81b9acae-5590-4bf2-be51-6c2bcc4b8b0b))
  (pad "12" smd rect (at -2.85 2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 45e5e8f5-4b51-47e9-a241-af55d1a697bf))
  (pad "13" smd rect (at -2.85 3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a23ba147-89dc-4edc-add2-96b289cf763d))
  (pad "14" smd rect (at -2.85 4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp aff0b798-4d63-4b0f-9b04-8fafbf0b5422))
  (pad "15" smd rect (at 2.85 4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fdf7583f-40f1-42e5-85d3-a77fd1f8f64c))
  (pad "16" smd rect (at 2.85 3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a61c4369-4d2f-4b9d-9968-463616206e19))
  (pad "17" smd rect (at 2.85 2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8e9adacb-b747-430a-b01f-bfdaf3a565c2))
  (pad "18" smd rect (at 2.85 2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e6e6960d-98b5-4c5c-b535-91634b676e8b))
  (pad "19" smd rect (at 2.85 1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0cb5e048-6544-40ba-a36e-72ba7f9083ff))
  (pad "20" smd rect (at 2.85 0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 15991fca-f6ec-4c1f-b740-f8631828e0b0))
  (pad "21" smd rect (at 2.85 0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp f2c734fd-5395-491e-a08a-fdbfaf10b09f))
  (pad "22" smd rect (at 2.85 -0.325) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp caa8d62b-daf6-4f95-b13e-70f60b44b139))
  (pad "23" smd rect (at 2.85 -0.975) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp c4020e88-662d-4743-98d6-2c640ed7b8aa))
  (pad "24" smd rect (at 2.85 -1.625) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3232fa6f-01df-4150-8d4e-ad410ee7a775))
  (pad "25" smd rect (at 2.85 -2.275) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a4267800-5630-42b5-96bb-115209153779))
  (pad "26" smd rect (at 2.85 -2.925) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e3b324b8-6ae5-444d-843e-30d11feb9159))
  (pad "27" smd rect (at 2.85 -3.575) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 4c76d366-6485-477e-b311-fa018b8f7cc9))
  (pad "28" smd rect (at 2.85 -4.225) (size 1.1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d14616e3-65e5-40ce-9b1e-93297444bbc9))
  (pad "29" smd rect (at -0.6 -2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 247b2a5c-8916-4ccf-bec3-a24f3e9fd0d8))
  (pad "29" smd rect (at -0.6 -0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 248174b4-f500-4316-b8f4-fda372d3e5e9))
  (pad "29" smd rect (at -0.6 0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 248997f2-c686-4cb3-acd8-24837eb2e0d3))
  (pad "29" smd rect (at -0.6 2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 8a7dfce6-66f5-49db-9f84-c9ceabd69c7e))
  (pad "29" smd rect (at 0.6 2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp c10d22f2-8bba-4ece-9aa4-a47a39fc1b36))
  (pad "29" smd rect (at 0.6 -0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp d4b322cc-9391-4e0b-a2af-a502c8c50f19))
  (pad "29" smd rect (at 0.6 0.77125) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp e6e68165-5ae2-42c5-b8af-016fa621a0a7))
  (pad "29" smd rect (at 0.6 -2.31375) (size 1.2 1.5425) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp f076fab1-81d3-4442-b085-b072306f77ec))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28_4.4x9.7mm_Pitch0.65mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)