(footprint "TSSOP-44_4.4x11.2mm_P0.5mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02F25C)
  (descr "TSSOP44: plastic thin shrink small outline package; 44 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf)")
  (tags "SSOP 0.5")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp c9f66937-f912-42df-9b00-2d12e5a5f16d)
  )
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9bf8eff9-5c48-4d18-8bd6-e1c7990ff9c5)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.8 0.8) (thickness 0.15)))
    (tstamp 718027e1-1117-4a2d-9dc9-14f1221cab01)
  )
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  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-44_4.4x11.2mm_P0.5mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)