(footprint "Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias" (version 20211014) (generator pcbnew)
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  (tedit 5B0C20CF)
  (descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf")
  (tags "HTSOP 1.27")
  (solder_mask_margin 0.07)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 63a7c695-06fe-416f-a8dd-5d8104d263a3)
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    (tstamp b2b94442-ccc2-4d7d-8b58-f65bb4272b97)
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  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.85x4.9mm_Mask2.4x3.1mm_ThermalVias.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)