(footprint "Texas_S-PDSO-N12" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02F1D8)
  (descr "http://www.ti.com/lit/ds/symlink/bq27441-g1.pdf")
  (tags "SON thermal pads")
  (attr smd)
  (fp_text reference "REF**" (at -0.000701 -2.517393) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 2caa3b68-081c-43ef-8a4a-505d7c87ca0e)
  )
  (fp_text value "Texas_S-PDSO-N12" (at -0.000701 2.852607) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp c11c10f3-ae77-4b99-b216-27a8b5fe605b)
  )
  (fp_text user "${REFERENCE}" (at -0.000701 0.002607) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 91033fbb-c8c1-4a76-b1e6-e47cce56a304)
  )
  (fp_line (start -2.1 1.4) (end -2.1 1.25) (layer "F.SilkS") (width 0.12) (tstamp 05f47e51-2da4-4b27-ba43-afb9f561da25))
  (fp_line (start 1.5 -1.4) (end 2.1 -1.4) (layer "F.SilkS") (width 0.12) (tstamp 3af71674-f2b6-4e22-ad46-18619d56d681))
  (fp_line (start 0.7 -1.4) (end -0.7 -1.4) (layer "F.SilkS") (width 0.12) (tstamp 3f0cb77f-d3f0-4f70-b8e1-e3952d2444f7))
  (fp_line (start 2.1 1.4) (end 2.1 1.25) (layer "F.SilkS") (width 0.12) (tstamp 428e017c-4c4e-4b02-937c-7fa635831e28))
  (fp_line (start 2.1 -1.4) (end 2.1 -1.25) (layer "F.SilkS") (width 0.12) (tstamp 8c4e3ac2-6c09-4ab9-9f4d-850c46cf0c0c))
  (fp_line (start -1.5 1.4) (end -2.1 1.4) (layer "F.SilkS") (width 0.12) (tstamp a5a8d007-2d80-4557-a7f3-80e154699e7e))
  (fp_line (start -1.500701 -1.397393) (end -2.400701 -1.397393) (layer "F.SilkS") (width 0.12) (tstamp c9090b49-f995-476c-a375-56e938e7d1fb))
  (fp_line (start 2.1 1.4) (end 1.5 1.4) (layer "F.SilkS") (width 0.12) (tstamp e953d871-e4b7-4887-971b-bc92a0b25c83))
  (fp_line (start 0.7 1.4) (end -0.7 1.4) (layer "F.SilkS") (width 0.12) (tstamp ebb43531-96ea-461a-a77d-612fd3fe47e9))
  (fp_line (start -2.6 -1.83) (end 2.61 -1.83) (layer "F.CrtYd") (width 0.05) (tstamp 223b49ad-8568-43ed-9d9c-5d27207bffb8))
  (fp_line (start 2.61 1.82) (end 2.61 -1.83) (layer "F.CrtYd") (width 0.05) (tstamp 3db1c44b-cc55-44fc-80f6-f5c769a480c8))
  (fp_line (start -2.6 1.83) (end 2.61 1.83) (layer "F.CrtYd") (width 0.05) (tstamp c26c08f7-e640-483d-85a5-f106b30d1327))
  (fp_line (start -2.6 1.83) (end -2.6 -1.83) (layer "F.CrtYd") (width 0.05) (tstamp d9a68a71-7259-49c3-964d-79fc9da7a858))
  (fp_line (start -1.120701 -1.297393) (end 1.999299 -1.297393) (layer "F.Fab") (width 0.1) (tstamp 16d54b71-a4d6-41a0-88cd-070c3eb8a225))
  (fp_line (start -2.000701 -0.417393) (end -2 1.3) (layer "F.Fab") (width 0.1) (tstamp 9f78721c-db0d-48ec-bdc6-04a106abe49a))
  (fp_line (start -2.000701 -0.417393) (end -1.120701 -1.297393) (layer "F.Fab") (width 0.1) (tstamp ab32cd08-9a7a-4e04-8e28-22d4f17f1209))
  (fp_line (start 2 1.3) (end 1.999299 -1.297393) (layer "F.Fab") (width 0.1) (tstamp c78fb45e-8a56-43c1-8bf8-d5a4b734f9fa))
  (fp_line (start -2 1.3) (end 2 1.3) (layer "F.Fab") (width 0.1) (tstamp e2e9f289-b1d8-434c-9460-45253c7f944a))
  (pad "1" smd rect (at -2.3 -1) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 0ee3ab75-f1bc-4031-90ae-117536811793))
  (pad "1" smd oval (at -1.975 -1) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 989a68f6-bd91-4eb5-b85a-db0d84ce65cd))
  (pad "2" smd oval (at -1.975 -0.6) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 6a3afa52-4571-402f-a2cf-3142161ae111))
  (pad "2" smd rect (at -2.3 -0.6) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp f9609b60-e5d1-4ca8-9a19-1dc08d3e1012))
  (pad "3" smd oval (at -1.975 -0.2) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp a53b5bb7-c9f0-4706-853c-6b27d34f023f))
  (pad "3" smd rect (at -2.3 -0.2) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp edbbfa3d-faab-498e-9ebc-bb0539b5d158))
  (pad "4" smd rect (at -2.3 0.2) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 569563f3-6557-42d8-a9b9-d1f56b3fe579))
  (pad "4" smd oval (at -1.975 0.2) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 6cb6f99a-3e30-461d-aa98-269140ad9324))
  (pad "5" smd rect (at -2.3 0.6) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 8c81e5b4-ce77-4bbc-9f90-bcb12b5fffee))
  (pad "5" smd oval (at -1.975 0.6) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp f75bfb19-e2aa-4ef4-96c4-300d7ae5dec5))
  (pad "6" smd oval (at -1.975 1) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 123f5647-0019-465e-a9ba-99d291a97c39))
  (pad "6" smd rect (at -2.3 1) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 2bdec37a-7a46-4dcb-a309-4cd2b56ec6d2))
  (pad "7" smd oval (at 1.975 1) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 7d91d4b6-596b-4565-9d4d-b2c44a0e715b))
  (pad "7" smd rect (at 2.3 1) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 95d9ae70-0593-4322-8361-f3867a36b9ea))
  (pad "8" smd oval (at 1.975 0.6) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 11b3f6a2-e0c5-4f82-b50a-278e64b62cc2))
  (pad "8" smd rect (at 2.3 0.6) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 2dba9502-29cb-4493-bf61-4a2110c6d5aa))
  (pad "9" smd rect (at 2.3 0.2) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 3590f35c-e1d2-4193-a7c2-041022173193))
  (pad "9" smd oval (at 1.975 0.2) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 484762da-076d-4954-845d-aee7d06e1380))
  (pad "10" smd oval (at 1.975 -0.2) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 1b74f5b9-d2e1-429b-91c9-00b6bc07d2e0))
  (pad "10" smd rect (at 2.3 -0.2) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 934a9e07-cd69-422c-ae46-bd4bda78f0b7))
  (pad "11" smd oval (at 1.975 -0.6) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 15514d66-8110-4851-93e1-c267061e56b2))
  (pad "11" smd rect (at 2.3 -0.6) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp c7c8f57a-4481-451f-97bd-0e3aa046fa05))
  (pad "12" smd rect (at 2.3 -1) (size 0.2 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 124afca9-1c52-4f92-94e1-ff0bf7da03b6))
  (pad "12" smd oval (at 1.975 -1) (size 0.85 0.2) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_mask_margin 0.05) (tstamp 2403d9bd-d82b-44da-91a8-400640aabf44))
  (pad "13" smd rect (at -0.65 0.4875 90) (size 0.975 1.3) (layers "F.Cu" "F.Paste")
    (solder_paste_margin -0.1) (tstamp 0993b042-db73-489f-911d-9ffde35b3ce4))
  (pad "13" smd rect (at 1.1 -1.3125 270) (size 0.675 0.4) (layers "F.Cu" "F.Mask") (tstamp 190ce4a8-3dbe-44b7-931e-26ee53b47000))
  (pad "13" thru_hole circle (at 0 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 1b53244f-257f-4282-a26b-2413f9677e74))
  (pad "13" thru_hole circle (at 0.9 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 3a8c038d-e8bf-4703-bf7f-4b0a7c1ec549))
  (pad "13" smd rect (at 1.1 1.365 270) (size 0.575 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 3c173838-7f0b-4df7-b6cd-914affa16f36))
  (pad "13" smd rect (at 1.1 -1.365 270) (size 0.575 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 48a837ff-c277-49a5-8da2-9da0bfab2bfa))
  (pad "13" thru_hole circle (at 0.9 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 49c78cf7-beaa-45a0-acb3-dc022c8bcf36))
  (pad "13" smd rect (at 0 0 270) (size 1.95 2.6) (layers "F.Cu" "F.Mask") (tstamp 4d44e200-24ba-4d2e-b945-8ffae659a313))
  (pad "13" thru_hole circle (at -0.9 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 57b3bc6c-d7bc-4bc4-84e0-f8dd1fbb2718))
  (pad "13" smd rect (at -1.1 1.365 270) (size 0.575 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 60557db4-2550-4cfa-9c89-af006b70f8c6))
  (pad "13" thru_hole circle (at 0 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp 72f6c3ee-f427-454a-b612-8d8d8029e341))
  (pad "13" smd rect (at 1.1 1.3125 270) (size 0.675 0.4) (layers "F.Cu" "F.Mask") (tstamp 747df031-d470-43b4-9a32-5fa50d0146d2))
  (pad "13" smd rect (at -1.1 -1.3125 270) (size 0.675 0.4) (layers "F.Cu" "F.Mask") (tstamp 80d3dad6-8989-492f-95e1-8006ba94d5e8))
  (pad "13" smd rect (at 0.65 -0.4875 90) (size 0.975 1.3) (layers "F.Cu" "F.Paste")
    (solder_paste_margin -0.1) (tstamp 828a269d-4c47-4556-953c-f0571aa5ed9d))
  (pad "13" smd rect (at -1.1 -1.365 270) (size 0.575 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8337ab88-446e-48c9-b3b8-62b14e0fb521))
  (pad "13" smd rect (at 0 0 270) (size 1.95 2.6) (layers "B.Cu" "F.Mask") (tstamp 8c360738-7c8f-46d4-9c04-d58d8a903cb3))
  (pad "13" thru_hole circle (at -0.9 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu) (tstamp a548a317-8160-4285-9a2b-f58f9c42cf1f))
  (pad "13" smd rect (at -1.1 1.3125 270) (size 0.675 0.4) (layers "F.Cu" "F.Mask") (tstamp a9af7b82-cb10-43cb-9719-8e5718e8899e))
  (pad "13" smd rect (at 0.65 0.4875 90) (size 0.975 1.3) (layers "F.Cu" "F.Paste")
    (solder_paste_margin -0.1) (tstamp bd0521e7-45be-4971-8932-24953c5274b4))
  (pad "13" smd rect (at -0.65 -0.4875 90) (size 0.975 1.3) (layers "F.Cu" "F.Paste")
    (solder_paste_margin -0.1) (tstamp c02853b4-9d1b-42e1-a535-4dec750981bf))
  (model "${KICAD6_3DMODEL_DIR}/Package_SON.3dshapes/Texas_S-PDSO-N12.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)