(footprint "VSON-8_3.3x3.3mm_P0.65mm_NexFET" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5A02F1D8)
  (descr "8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf")
  (tags "VSON 0.65")
  (attr smd)
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    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp bd662bd4-efa5-4f88-ac4f-676a707671ca)
  )
  (fp_text value "VSON-8_3.3x3.3mm_P0.65mm_NexFET" (at 0 2.8) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 9b4779b5-7b7a-4ed1-be17-8d16b533f2f8)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.7 0.7) (thickness 0.1)))
    (tstamp 69dc2a84-93eb-46db-a07e-c06c3486221e)
  )
  (fp_line (start -1.9 -1.8) (end 1.23 -1.8) (layer "F.SilkS") (width 0.12) (tstamp 40bc9a8b-b527-4143-8b6c-87098fc7b347))
  (fp_line (start -1.23 1.8) (end 1.23 1.8) (layer "F.SilkS") (width 0.12) (tstamp 845ebfe8-83d7-4f42-a16a-82d7596b751c))
  (fp_line (start -2 -1.9) (end 2 -1.9) (layer "F.CrtYd") (width 0.05) (tstamp 26563438-5bf6-45ba-bec5-d2f7f2b7c2c4))
  (fp_line (start 2 -1.9) (end 2 1.9) (layer "F.CrtYd") (width 0.05) (tstamp 31fc1ed4-46f8-411b-8073-4fb7b0090056))
  (fp_line (start -2 -1.9) (end -2 1.9) (layer "F.CrtYd") (width 0.05) (tstamp 3f5fdc0f-a970-4690-b040-96d596856e2e))
  (fp_line (start -2 1.9) (end 2 1.9) (layer "F.CrtYd") (width 0.05) (tstamp a7e394dc-5468-4340-bcc9-7e1622db3910))
  (fp_line (start 1.65 1.65) (end -1.65 1.65) (layer "F.Fab") (width 0.1) (tstamp 084f75b4-95d5-4ac6-a2a5-274c23b64e85))
  (fp_line (start -1.65 1.65) (end -1.65 -0.5) (layer "F.Fab") (width 0.1) (tstamp 35e3d111-27bf-4dcc-8e70-f8b7d2ba34f2))
  (fp_line (start -1.65 -0.5) (end -0.5 -1.65) (layer "F.Fab") (width 0.1) (tstamp 3a2ce660-b77f-4645-922c-f92a872a09ab))
  (fp_line (start -0.5 -1.65) (end 1.65 -1.65) (layer "F.Fab") (width 0.1) (tstamp 45dfa972-1c25-417b-a133-e7968f086c7c))
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  (pad "3" smd rect (at -1.44 0.33) (size 0.63 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1e3da2a9-0ef8-4157-9786-8863af81ce71))
  (pad "4" smd rect (at -1.44 0.97) (size 0.63 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0cb27dee-207e-4d00-b179-c375f3556fab))
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    (solder_paste_margin_ratio -0.2) (tstamp 06565fe3-cccb-4978-8814-254d134ce7fa))
  (pad "5" smd rect (at 1.44 0.97) (size 0.63 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0a7a0244-b123-4286-8cc3-24475d1d6c9e))
  (pad "5" smd rect (at 1.44 0.33) (size 0.63 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 1e693703-274b-477f-a91c-0955874317a4))
  (pad "5" smd rect (at 0.86 0.61) (size 0.95 1.23) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 3f9b4c14-886a-4cb6-82d1-d023e8aca288))
  (pad "5" smd rect (at -0.09 -0.61) (size 0.95 1.23) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 6eeec194-6697-4301-9f3b-e92cce524f5f))
  (pad "5" smd rect (at 1.44 -0.33) (size 0.63 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 7d2a9d5f-7a4b-4c21-b479-869422e590bf))
  (pad "5" smd rect (at 1.44 -0.97) (size 0.63 0.5) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp afb642da-c950-4242-95dc-37ed16388dfa))
  (pad "5" smd rect (at 0.86 -0.61) (size 0.95 1.23) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp dac42578-92c0-4b3b-844d-f88564315224))
  (model "${KICAD6_3DMODEL_DIR}/Package_SON.3dshapes/VSON-8_3.3x3.3mm_P0.65mm_NexFET.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)